New College Grad - Mixed Signal Design Engineer, HBM

Job Title

New College Grad - Mixed Signal Design Engineer, HBM

Role Summary

Join Micron’s Memory Systems Engineering team to design digital and mixed-signal building blocks for high-bandwidth memory (HBM) base die. The role focuses on micro-architecture, RTL implementation, verification collaboration, and support for silicon bring-up to meet bandwidth, latency, power, and reliability targets.

Experience Level

Entry-level — new college graduate or early-career engineer. Suitable for candidates with academic projects, internships, or limited industry experience in digital design or SoC integration.

Responsibilities

Primary responsibilities include designing micro-architecture, implementing RTL, and supporting verification and silicon validation.

• Define and implement digital micro-architecture for HBM base-die subsystems: channel support logic, boot/initialization sequencing, training orchestration, configuration/status registers, telemetry, performance counters, and reliability features.
• Translate system requirements into timing, power, and area constraints; maintain interface specifications for bus protocols, clock-domain crossings, and reset strategies in coordination with physical-layer and system architects.
• Develop and integrate synthesizable SystemVerilog RTL for multi-channel logic, interrupts, register maps, scan hooks, and design-for-test interfaces; support integration and ECO flows.
• Work with design verification on verification planning, coverage goals, CDC/RDC checks, and debugging of RTL, testbench, and gate-level issues.
• Support silicon bring-up and post-silicon validation through debug enablement, root-cause analysis, and collaboration with DFT and test teams.

Requirements

Must-have technical skills and early-career experience; preferred items listed separately.

• Practical experience with digital design or SoC integration from academic projects, internships, or early industry roles.
• SystemVerilog RTL development experience.
• Familiarity with clock/reset architecture, CDC/RDC methodologies, and low-power design concepts.
• Understanding of design-for-debug and design-for-test principles and ability to work with cross-functional engineering teams.
• Willingness to use AI-assisted tools to support engineering productivity, debugging, and data-driven analysis.

Nice-to-have:

• Exposure to post-silicon validation, silicon bring-up, or structured debug workflows.
• Familiarity with scan, MBIST, LBIST, or related test and debug features.
• Experience contributing to verification plans and partnering with verification teams to meet coverage goals.
• Interest or experience refining micro-architecture for timing and design tradeoffs.
• Experience applying AI for data analysis, debug automation, or performance optimization in semiconductor design.

Education Requirements

Bachelor’s degree in Electrical Engineering or Computer Engineering, or equivalent practical experience. Related technical degrees or equivalent experience from academic projects and internships are acceptable.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.