New College Grad - HBM SoC Design Engineer/Architect

Job Title

New College Grad - HBM SoC Design Engineer/Architect

Role Summary

Join the Heterogeneous Integration Group to design, integrate, and validate HBM logic die and memory-centric SoCs. Work with architects, RTL designers, verification, physical design, firmware, and product teams to meet power, performance, area, quality, and schedule targets.

Experience Level

Entry-level - new college graduate. Position expects recent graduates with academic, research, internship, or project experience in relevant disciplines.

Responsibilities

Key technical responsibilities include:

• Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for HBM SoC solutions.
• Collaborate with architects and cross-functional teams to translate requirements into microarchitectures, interfaces, and implementation plans.
• Support design-quality activities: simulation, synthesis, static timing analysis, CDC analysis, debugging, and design reviews.
• Evaluate power, performance, area, and timing tradeoffs and produce data-driven recommendations.
• Develop automation and leverage AI-assisted workflows, generative AI, LLMs, or agentic AI to improve productivity and verification efficiency.
• Participate in design integration and validation across silicon and subsystem levels.

Requirements

Core technical skills and experience expected:

• Must-have: Academic, research, internship, or project experience in digital design, ASIC/FPGA development, or computer architecture.
• Must-have: Working knowledge of Verilog, SystemVerilog, VHDL, or another hardware description language.
• Must-have: Understanding of digital design fundamentals: FSMs, pipelining, clocking, reset strategies, timing, and synchronous logic.
• Must-have: Strong analytical, problem-solving, and written/verbal communication skills; ability to work in collaborative engineering teams.
• Nice-to-have: Familiarity with synthesis, static timing analysis (STA), simulation, formal verification, UVM, or FPGA prototyping.
• Nice-to-have: Knowledge of memory systems and high-speed interfaces (HBM, DDR, LPDDR, PCIe, CXL).
• Nice-to-have: Experience applying automation, AI-enabled tools, generative AI, or LLMs to semiconductor design and verification workflows.

Education Requirements

Required: Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date. Preferred: Master's or Ph.D. in Electrical Engineering, Computer Engineering, or a related technical discipline completed prior to the employment start date. The posting also recognizes academic, research, internship, or project experience in lieu of industry experience for this new-graduate role.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.