New College Grad - HBM Design Architect (MS or PhD)
Micron TechnologyJob Title
New College Grad - HBM Design Architect (MS or PhD)
Role Summary
Contribute to evaluation and development of future HBM and DRAM architectures on the Heterogeneous Integration Group's HBM Architecture team. Work with cross-functional engineering teams to analyze system- and block-level tradeoffs and support architecture exploration.
Use analytical models, simulation, measured silicon data, and data-driven/AI-assisted techniques to inform design choices for performance, power, area, thermal behavior, reliability, and manufacturability.
Experience Level
Entry-level - new college graduate.
Responsibilities
The role focuses on architecture analysis, modeling, and cross-team technical collaboration.
- Analyze HBM and DRAM architectures using models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity.
- Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches and identify design sensitivities.
- Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, signal integrity, power delivery, and manufacturability.
- Perform root-cause analysis using simulation and measured data to improve model accuracy and validate assumptions.
- Communicate technical findings through presentations, design reviews, and written documentation, clearly stating assumptions, risks, and recommendations.
Requirements
Must-have technical skills and capabilities for successful performance in this role.
- Strong foundation in at least two of: CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
- Experience developing engineering models, simulations, or analytical methodologies via graduate research, coursework, internships, or laboratory projects.
- Ability to evaluate complex technical problems and draw evidence-based conclusions.
- Strong analytical, problem-solving, written communication, and verbal communication skills.
Nice-to-have:
- Experience with circuit-design and simulation tools (HSPICE, FineSim, Spectre, or similar).
- Experience with high-speed interfaces, memory controllers, 3D integration, or HBM/DRAM-related projects.
- Experience using data analytics, AI, or LLMs to support engineering analysis and design exploration.
- Technical communication through publications, presentations, patents, or detailed design reports.
Education Requirements
Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date. Graduate research, thesis/dissertation, internships, or equivalent project experience related to memory systems, device/circuit design, or advanced packaging are referenced as relevant background.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
