New College Grad - Design Engineer, HBM

Job Title

New College Grad - Design Engineer, HBM

Role Summary

Entry-level design engineer working on analog and digital circuits for high-bandwidth memory (HBM) products. The role supports circuit design, layout, simulation, verification, and tape-out readiness across interdisciplinary teams.

The engineer will collaborate with product engineering, test, probe, process integration, assembly, and verification teams to optimize manufacturability, cost, quality, reliability, and time-to-market.

Experience Level

Entry-level (new college graduate). Recent graduates or those with limited professional experience are targeted for this role.

Responsibilities

Typical responsibilities include hands-on design, validation, and cross-team coordination across the semiconductor product flow.

• Support circuit design, layout, and optimization for memory, logic, or mixed-signal circuits.
• Perform parasitic extraction/modeling and support design validation, including reticle experiments and tape-out revisions.
• Manage layout activities: floor-planning, placement, and routing.
• Run simulations and verification using industry-standard tools (FastSPICE, HSPICE, etc.).
• Collaborate with cross-functional partners to ensure manufacturability and tape-out readiness.
• Incorporate guidance from CAD, modeling, and verification teams to improve design quality and standardization.

Requirements

Key technical requirements and desirable qualifications.

• Must-have: Extensive knowledge of CMOS circuit design and semiconductor device physics.
• Must-have: Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
• Must-have: Strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.
• Must-have: Experience using AI-enabled or AI-assisted tools for simulation, modeling, data analysis, or productivity improvements.
• Nice-to-have: Exposure to statistical or Monte Carlo simulation techniques and mixed-signal verification workflows.
• Nice-to-have: Experience with memory interfaces, HBM architectures, or mixed-signal IP integration (coursework or internships).
• Nice-to-have: Prior RTL/register-transfer level (RTL) design flow experience in DRAM or foundry processes.
• Nice-to-have: Strong verbal and written communication skills for conveying complex technical concepts.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering or a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.