Neuromorphic Front-End Silicon Lead

Job Title

Neuromorphic Front-End Silicon Lead

Role Summary

Lead front-end silicon design and verification for neuromorphic chiplets and IP, managing a multidisciplinary team and coordinating with architecture, physical design, software, and systems teams to deliver manufacturable silicon. The role focuses on implementing processor/accelerator microarchitectures and integrating high-speed interfaces and memory subsystems.

Experience Level

Senior-level; requires approximately 10+ years of relevant hands-on silicon design experience and 3+ years leading design or verification teams.

Responsibilities

Lead and execute front-end design and verification from microarchitecture through post-silicon validation. Key responsibilities include:

• Translate architecture and research innovations into implementable microarchitectures.
• Manage design and verification through synthesis, timing closure, CDC/RDC, formal methods, DFV, and post-silicon bring-up.
• Partner with physical and custom design engineers; prototype blocks through place-and-route and co-design custom circuits such as memories.
• Evaluate, select, and integrate internal and external IP, including I/O interfaces.
• Enable early software and systems development prior to tape-out and support post-silicon bring-up.
• Mentor engineers and strengthen scalable design and verification practices as the program grows.

Requirements

Must-have technical skills and experience:

• 10+ years hands-on design experience in processors, accelerators, SoCs, or custom ASICs.
• 5+ years RTL design experience with Verilog/SystemVerilog and modern ASIC flows (synthesis, timing closure, CDC/RDC, formal, DFV).
• 3+ years leading silicon design and/or verification teams.
• Experience with SoC integration and high-speed interfaces such as Ethernet and PCIe/UCIe, and memory controller integration.
• Experience with pre-silicon enablement via emulation or FPGA prototyping.
• Track record of technical ownership on multiple product tape-outs.

Nice-to-have:

• Advanced packaging and heterogeneous integration (chiplets, UCIe, 2.5D/3D).
• Asynchronous design methods and custom memory/circuit co-design.
• Low-power methods (UPF) and hardware security features such as Root of Trust/secure boot.

Education Requirements

MS in Electrical/Computer Engineering, Computer Science, or a related field required. PhD in a related area (hardware acceleration/AI) preferred. Related technical degrees or equivalent relevant experience considered.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.