MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
GlobalFoundriesJob Title
MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
Role Summary
Lead development, startup and transfer of advanced packaging processes (bond/debond, pre-bond plasma/UV/cleaning, die re‑constitution, annealing, TSV) for 2.5D/3D heterogeneous integration on 300mm wafers. Support tooling start-up, process qualification, manufacturing transfer, troubleshooting and cross-functional coordination within the Advanced Packaging center.
Experience Level
Senior — experience guidance: 4+ years (PhD), 6+ years (MSc), 8+ years (BSc).
Responsibilities
Accountable for process development, equipment qualification, production transfer and continuous improvement of advanced packaging modules.
- Design, execute and analyze experiments to develop etch and related advanced packaging processes to meet performance, yield, reliability and manufacturing targets.
- Startup, qualify and match new processes and equipment; collaborate with Equipment Engineering on acceptance and productivity improvements.
- Troubleshoot complex process and tool issues; perform root-cause analysis and implement corrective actions.
- Improve process robustness for high-volume manufacturing using DOE, SPC, statistical tools, lean and Six Sigma methods.
- Support Integration and Quality teams to ensure qualification and reliability requirements are met.
- Own processes and tools in manufacturing; sustain and improve SPC to meet quality, cost and productivity targets.
- Coach and develop engineers; lead cross-module projects and continuous improvement programs to optimize process windows, cost, yield and productivity.
- Perform all activities in compliance with Environmental, Health, Safety & Security requirements.
Requirements
Key technical and professional requirements (education summarized separately below).
- Extensive experience in advanced packaging process development and manufacturing (Si interposer, Die-to-Wafer, Wafer-to-Wafer).
- Hands-on experience with packaging process tools and multi-stack bond wafer / die-level and frame-level processes (bond/debond, pre-bond plasma/UV/clean, anneal, TSV, die re-constitution).
- Proven track record leading fab-wide cross-module process development and coordinating projects across functions.
- Strong data-driven problem solving using DOE, SPC, R&R and statistical analysis.
- Experience in equipment startup, qualification, tool matching and improving equipment productivity indices.
- Excellent verbal and written communication and ability to work effectively across cultures.
- Experience mentoring or training engineers and leading cost-reduction / continuous improvement initiatives.
Education Requirements
Required: Bachelor's, Master's or PhD in Electrical Engineering, Materials Science & Engineering, Chemical Engineering, Physics, or a related engineering discipline. The posting maps required years of experience by degree level (PhD: 4+ years; MSc: 6+ years; BSc: 8+ years).
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
