MTS HIG-HBM Layout

Job Title

MTS HIG-HBM Layout

Role Summary

Lead end-to-end layout execution for HBM (High Bandwidth Memory) products, covering analog, mixed-signal, custom digital blocks and full-chip integration. Responsible for technical decisions affecting performance, power and area (PPA) and for delivering high-quality layouts on schedule.

Experience Level

Senior-level. Requires extensive experience in analog/custom layout (18+ years) and leadership experience (4+ years) developing teams and managing projects.

Responsibilities

Primary responsibilities include technical leadership, layout delivery, verification oversight, and team development.

• Lead end-to-end layout execution of analog, mixed-signal and custom digital blocks and integrate full-chip layouts for HBM products.
• Own full-chip technical decisions across analog, digital, memory, ESD, EM/IR to meet PPA targets.
• Execute and review critical block layouts: arrays, decoders, control logic, I/Os, PLLs, ADCs/DACs, LDOs, bandgaps, charge pumps, current mirrors, comparators, differential amplifiers.
• Plan and drive project execution: area/time estimation, scheduling, task allocation and milestone tracking for multiple concurrent programs.
• Ensure timely delivery and quality of block-level and full-chip layouts; maintain documentation and audit readiness.
• Oversee layout verification (DRC, LVS, antenna checks) and ensure closure with proper sign-off.
• Lead, mentor and grow the layout team; conduct design reviews and enable capability development.
• Promote productivity improvements and adoption of automation/AI to reduce effort and turnaround time.
• Collaborate with global cross-functional teams (design, verification, IP, packaging) and support customer/product integration needs.

Requirements

Key must-have skills and experience; concise listing below.

• Must-have: 18+ years of analog/custom layout experience in advanced CMOS processes.
• Must-have: Minimum 4+ years leading teams and projects; experience managing multiple projects and tape-outs.
• Must-have: Proven expertise with Cadence VLE/VXL and Calibre DRC/LVS.
• Must-have: Strong skills in layout, floorplanning and manual routing; experience running multiple custom IC layout projects.
• Excellent verbal and written communication skills and ability to work across multiple sites and time zones.
• Nice-to-have: Prior HBM or advanced memory product experience; experience driving AI/automation for layout productivity.

Education Requirements

BE or MTech in Electronics or VLSI Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.