MTS Design Architect - Custom Layout, HBM

Job Title

MTS Design Architect - Custom Layout, HBM

Role Summary

Lead physical design and layout for analog, mixed-signal and custom digital blocks and full-chip integration for next-generation High Bandwidth Memory (HBM) products. Work with architecture, circuit build, and layout teams to define floorplans, placement and routing strategies, and deliver high-quality block layouts using advanced process nodes.

The role emphasizes PPA (performance, power, area), reliability, and integration across Memory, Logic and Analog domains and supports AI-enabled layout acceleration.

Experience Level

Senior. Experience guidance in posting: MS +8 years memory-related custom layout design, or BS +12 years relevant experience.

Responsibilities

Primary responsibilities include technical leadership of layout and full-chip integration for HBM designs.

• Lead end-to-end layout execution of analog, mixed-signal and custom digital blocks and oversee overall chip integration for HBM products.
• Own full-chip technical decisions affecting analog, digital, memory, ESD, EM/IR and PPA tradeoffs.
• Create and drive optimized floorplans, placement and routing strategies.
• Develop high-quality block-level layouts (array, decoders, IOs, PLLs, ADCs, DACs, LDOs, bandgaps, reference generators, charge pumps, current mirrors, comparators, differential amplifiers, etc.).
• Collaborate with architects and circuit designers to integrate Memory, Logic and Analog circuits into new HBM architectures.
• Provide design guidance to improve robustness, performance and reliability; participate in reviews, parasitic extraction and issue resolution across the physical build flow.

Requirements

Must-have:

• Hands-on analog and mixed-signal custom layout experience, including array and peripheral layouts, sense amps, LDOs, PLLs, and other critical blocks.
• Expertise with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
• Strong understanding of analog layout fundamentals: matching, EM, latch-up, coupling, IR-drop, crosstalk and parasitic impacts.
• Proven ability to drive floorplanning, placement and routing decisions for complex chips.
• Analytical problem-solving skills and demonstrated collaboration across design, architecture and verification teams.
• Experience leveraging AI to accelerate layout development.

Nice-to-have:

• Prior experience with DRAM or HBM custom layout projects.
• Clear technical communication and ability to work in fast-paced team environments.

Education Requirements

MS degree with 8+ years of memory-related custom layout design experience, or BS degree with 12+ years of relevant experience; equivalent practical experience accepted. No specific fields of study or certifications were specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.