Module Integration Design Engineering Intern

Job Title

Module Integration Design Engineering Intern

Role Summary

The Module Integrator Intern will support development of RF front-end multi-chip modules for 5G/6G smartphone applications. You will work with cross-functional engineering teams to integrate power amplifiers, filter dies, SOI dies, and SMDs into compact modules that meet electrical, mechanical, and cost targets.

This is an engineering internship within the RF integration team focused on simulation, modeling, and verification to optimize module performance and compliance with specifications.

Experience Level

Entry-level — Internship for current college students (undergraduate or graduate). Specific years of post-graduate experience not required; position is targeted at students currently enrolled in degree programs.

Responsibilities

Typical responsibilities for the role include:

• Contribute to the design and integration of RF front-end modules (RF-FEM) including PAs, SOI dies, filter dies, and SMDs while balancing size, cost, and schedule.
• Build and validate HFSS and other EM models of multi-functional RF modules to optimize performance and minimize unwanted coupling and shielding issues.
• Run full-module simulations across functional states to identify compliance issues and propose corrective actions to improve margins.
• Provide design schematics, simulation results, and correlate with lab measurement data.
• Work collaboratively with cross-functional teams to meet project milestones and deliverables.

Requirements

Minimum and preferred technical skills and attributes.

• Must-have: Coursework or hands-on experience in RF and analog circuit design and strong understanding of electronics concepts (impedance matching, gain, loss, noise figure, stability).
• Must-have: Experience with simulation and EDA tools such as ADS, HFSS, Momentum, Cadence, EMX, AWR, or similar.
• Must-have: Strong problem-solving skills, effective oral/written communication, and organized, detail-oriented work habits.
• Nice-to-have: Experience with passive RF structures (filters, couplers, dividers, antennas), active CMOS circuit tape-out, and lab characterization using spectrum/network analyzers.

Education Requirements

Internship for students currently enrolled in an accredited Bachelor's, Master’s, or PhD program. The posting specifically seeks students pursuing a Master’s or PhD in Electrical Engineering; coursework/experience in RF and analog circuit design is expected. Minimum GPA 3.0. Related technical fields are acceptable where relevant.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.