Module Engineer (Night Shift 6)

Job Title

Module Engineer (Night Shift 6)

Role Summary

Work as an onsite packaging/module engineer on night shift to develop and improve assembly processes, equipment, and reliability methods for semiconductor packages. The role supports manufacturing quality, yield, and process qualification for advanced packaging technologies.

The position is part of the Foundry Technology Manufacturing organization and collaborates with design, supplier quality, procurement, and partner engineering groups to meet product milestones.

Experience Level

Entry-level / Early Career — typically 1+ years of relevant manufacturing or engineering experience.

Responsibilities

Core responsibilities include process and equipment development, reliability testing, and cross-functional support for manufacturing and qualification.

• Develop and optimize assembly and packaging processes to meet quality, reliability, cost, yield, and manufacturability targets.
• Create process and equipment specifications and apply DOE and statistical analysis to drive improvements; document results.
• Design, maintain, and use equipment to evaluate silicon and package technologies under simulated field conditions (temperature, humidity, mechanical forces).
• Ensure manufacturability of package layouts and oversee manufacturing process flows and procedures.
• Define material specifications and work with suppliers, procurement, and supplier quality to ensure material and vendor performance.
• Develop acceleration methods, tools, and screens to detect potential package quality and reliability issues early.
• Set reliability requirements, influence design/material selection, and address failure mechanisms.
• Lead problem-solving, continuous improvement, and experimental design efforts for equipment and processes.
• Provide technical consultation and respond to customer or manufacturing events as they occur.

Requirements

Minimum and preferred qualifications, plus role-specific work conditions.

• Must-have: 1+ years of manufacturing or engineering experience in a relevant environment.
• Must-have: Minimum 6 months experience applying Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Must-have: Ability to work the defined night shift schedule (Shift 6: 6 PM–6 AM Wed–Fri with alternating Saturday nights) and regular onsite presence.
• Must-have: This position is not eligible for immigration sponsorship.
• Nice-to-have: Experience in semiconductor packaging processes or a technology manufacturing environment.
• Nice-to-have: Hands-on experience with reliability testing equipment and package qualification methods.

Education Requirements

Required: Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related STEM field. Preferred: Master's degree. (The posting did not explicitly state an "equivalent experience" substitution for the degree requirement.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.