Module Engineer for Assembly Department

Job Title

Module Engineer for Assembly Department

Role Summary

Work on Assembly process and equipment engineering to sustain and improve manufacturing performance for semiconductor module assembly. The role leads operational issue resolution, drives process integration and new-technology transfers, and contributes to automation and Factory of the Future efforts.

Works with technicians and cross-functional manufacturing teams, participates in a Virtual Factory network, and supports deployment of AI/robotics solutions and advanced process controls.

Experience Level

Entry-level. Fresh graduates are invited to apply; no specific years of prior work experience required.

Responsibilities

Primary responsibilities include leading equipment/process resolution, supporting new technology integration, and improving automation and process control.

• Lead resolution of operational issues for Assembly processes and equipment.
• Optimize advanced process control systems to detect signals and automate defect containment.
• Define and maintain equipment maintenance and calibration procedures to sustain OEE standards.
• Engage and lead new technology development, product transfers and process integration.
• Develop process and equipment improvements with potential for patentable innovations.
• Drive AI and robotics deployment as part of Factory of the Future transformations.
• Participate in the Virtual Factory network to share cross-site learnings and resolve problems.
• Collaborate with technicians and manufacturing teams to implement control plans and PFMEA outcomes.

Requirements

Must-have technical skills, behavioral traits, and operational flexibility for the role.

• Strong English verbal and written communication skills.
• Self-motivated, team-oriented, data-driven, and a positive learner.
• Proficiency in Python and practical Machine Learning / Robotics concepts.
• Familiarity with embedded systems and real-time programming.
• Experience or knowledge in advanced packaging, package technology development, and semiconductor packaging processes; focus on equipment design, DFA/DFM, PFMEA, and control plan development.
• Willingness to work 12-hour shifts as needed.
• Nice-to-have: experience with OpenVINO, TensorFlow, C++, ROS, MATLAB, Gazebo, V-REP, Webots, and prior exposure to AI/robotics deployment or automation projects.

Education Requirements

Bachelor's or Master's degree in Electrical & Electronics Engineering, Mechanical, Mechatronics, AI/Robotics, Chemical engineering, or other related engineering majors. Fresh graduates are explicitly invited to apply.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.