Module Engineer (Day Shift 5 or 7)

Job Title

Module Engineer (Day Shift 5 or 7)

Role Summary

Work in Intel Foundry Technology Manufacturing to develop and optimize semiconductor package assembly processes and equipment. The role spans engineering, manufacturing, and technology development to deliver packaging solutions for foundry customers.

Primary responsibilities include process and equipment design, reliability and materials specification, and driving manufacturability and quality for foundry packaging platforms.

Experience Level

Entry-level / early career. Typical candidates have 1+ years of relevant engineering experience, or an advanced degree in a related STEM field.

Responsibilities

Key responsibilities include:

• Design and develop assembly processes and equipment to support foundry packaging platforms.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, and productivity targets.
• Define process and equipment specifications using Design of Experiments (DOE) and data analysis; document results in technical reports.
• Develop and maintain test setups to evaluate silicon and package technologies under thermal, humidity, and mechanical stress.
• Ensure package designs are manufacturable and manage the full cycle of production flows and procedures.
• Establish material specifications and work with suppliers, procurement, and supplier quality to enforce compliance.
• Create reliability screening and acceleration methods to detect packaging quality and reliability risks early.
• Lead continuous improvement initiatives using statistical methods and experimental design to troubleshoot and improve process/equipment performance.
• Serve as a technical resource for packaging challenges and engage with customers and partner engineering teams to assess process maturity and mitigate risk.

Requirements

Minimum requirements and role-specific skills. Education credentials are summarized separately under Education Requirements.

• US Citizenship required.
• Practical experience (industry, internship, or academic project work) applying DOE and statistical methods; at least 6+ months experience with Statistical Process Control (SPC) and/or DOE is expected.
• Familiarity with semiconductor packaging processes, assembly, materials, or reliability engineering is preferred.
• Experience developing test/evaluation equipment for thermal, humidity, and mechanical stress conditions.
• Ability to define material and supplier specifications and work cross-functionally with procurement and supplier quality.
• Strong analytical, problem-solving, and written communication skills; ability to produce technical reports and white papers.
• Hands-on approach to continuous improvement and process standardization in a manufacturing environment.

Education Requirements

Candidates typically hold a Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related STEM field (1+ years of experience). A Master’s degree in those fields is an accepted alternative. An Associate degree with 12+ years of relevant engineering experience is an alternate pathway. Qualifications can be achieved through a combination of formal education, internships, industry experience, and academic research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.