Module Development Engineer (Advanced Packaging)

Job Title

Module Development Engineer (Advanced Packaging)

Role Summary

Responsible for process integration and equipment development to enable semiconductor manufacturing for current high-volume and next-generation technologies. Works with internal engineering teams and external suppliers to develop processes, conduct feasibility studies, and support manufacturing ramp and technology roadmaps.

This position requires regular on-site presence in Hillsboro, OR to support manufacturing and business activities.

Experience Level

Entry-level / Early Career — typically 1+ years of relevant experience. Role is targeted at recent college graduates and early-career engineers.

Responsibilities

Key responsibilities include process development, equipment enablement, feasibility and pathfinding activities, and collaboration to support technology transfer and manufacturing ramp.

• Drive technology development and manufacturing enablement for current and future semiconductor technologies.
• Develop process integration and equipment solutions to meet device performance, quality, and manufacturability targets.
• Design advanced manufacturing processes: material selection, parameter optimization, metrology development, and system design.
• Perform process technology feasibility studies using engineering analysis, simulations, and experimental methods.
• Conduct pathfinding activities to support hardware and process development for emerging device architectures.
• Create and maintain technology roadmaps aligned with product and manufacturing requirements.
• Identify and implement process and equipment improvements to increase production efficiency and capability.
• Collaborate with equipment and material suppliers to develop enabling technologies.
• Support technology transfer, process qualification, and manufacturing ramp activities with cross-functional teams.

Requirements

Must-have core skills and experience; preferred items listed separately.

• 1+ years experience using Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Experience with semiconductor fabrication processes and manufacturing technologies.
• Strong technical problem-solving and analytical skills.
• Ability to lead or influence cross-functional teams and communicate effectively in writing and presentations.
• Experience conducting engineering analysis, simulations, and experimental studies.
• Ability to work independently while maintaining strong stakeholder alignment.
• Adaptability and willingness to learn new technologies, processes, and methodologies.

Nice-to-have: Experience in semiconductor technology development, foundry or high-volume manufacturing, and delivering results on time-sensitive technical projects.

Education Requirements

Minimum: Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline. (The posting specifies a Master's degree.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.