Module Development Engineer

Job Title

Module Development Engineer

Role Summary

Microelectronic packaging collateral engineer responsible for equipment collateral design, development, and sustaining support for semiconductor assemblies and related components. Focus areas include thermal, mechanical, and electrical design and analysis to define package performance and support qualification.

Work collaboratively with cross-functional teams (Quality Assurance, Purchasing, suppliers) to establish material specifications and resolve packaging-process issues.

Experience Level

Entry-level — requires at least 6+ months of relevant experience; preferred candidates may have 3+ years of experience in related areas.

Responsibilities

Primary duties include design, analysis, qualification, vendor specification, and technical support for packaging collaterals.

• Perform thermal, mechanical, and electrical design and analysis of packaging collaterals.
• Define package performance and specifications; develop and execute qualification plans and collect qualification data.
• Conduct materials testing and characterization to support design and manufacturing.
• Establish material specifications for contract assemblers and raw material vendors; interface with Quality Assurance and Purchasing on material quality and vendor performance.
• Provide engineering consultation to address packaging problems and recommend process improvements.
• Respond to customer or internal requests and events; troubleshoot production or design issues.
• Develop technical solutions using engineering analysis and judgment.

Requirements

Must-have skills and core experience for initial consideration; preferred items are listed separately.

• Minimum 6+ months of hands-on experience in mechanical design or packaging engineering.
• Experience with CAD (SolidWorks), DriveWorks, RSS analysis, geometric dimensioning, or finite element analysis.
• Mechanical design and problem-solving skills applicable to high-volume manufacturing.
• Familiarity with statistical design of experiments and analytical problem-solving techniques (preferred).

Nice-to-have

• 3+ years experience with material handling systems (high-speed/accuracy pick-and-place), motion control, and vision systems.
• Experience with semiconductor devices and packaging processes and technology.
• Stakeholder management experience (suppliers, project management, internal partners).

Education Requirements

Required: Bachelor's degree in Mechanical Engineering or a related STEM field. The posting notes typical backgrounds include industry-relevant job experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.