Module Development Engineer

Job Title

Module Development Engineer

Role Summary

Join Intel's Technology Development team in Hillsboro, OR to develop and optimize advanced semiconductor manufacturing processes. The role focuses on materials, process engineering, device feasibility, experimental execution, and supplier collaboration to advance manufacturing toward production.

Experience Level

Entry-level. Qualification-specific experience expectations: Bachelor's holders typically require ~4+ years of hands-on semiconductor processing experience; Master's holders typically require ~3+ years; PhD holders may qualify with no prior professional experience.

Responsibilities

Primary responsibilities include process development, experimentation, and cross-functional collaboration:

• Develop, optimize, and sustain semiconductor manufacturing processes, including materials selection, metrology, parameter tuning, and system design.
• Design and execute structured experiments (DOE) to meet device specifications, yield, and production targets.
• Perform feasibility studies and pathfinding for innovative device architectures and next-generation manufacturing roadmaps.
• Collaborate with equipment and materials suppliers to evaluate, qualify, and implement novel solutions.
• Use theoretical simulations and practical engineering techniques to assess process feasibility.
• Monitor industry trends and align development efforts with evolving semiconductor needs.
• Partner with cross-functional stakeholders and vendors to develop cost-effective technology roadmaps and meet operational goals.

Requirements

Must-have technical skills, domain experience, and candidate traits:

• Hands-on experience in process characterization, Statistical Process Control (SPC), and Design of Experiments (DOE).
• Knowledge of semiconductor manufacturing techniques: lithography, etching, deposition, and chemical-mechanical planarization (CMP).
• Experience in experimental design, data analysis, and manufacturing process improvement.
• Experience with thin-film deposition technologies, vacuum process systems, or opto-mechanics.
• Materials characterization methods (preferred): SEM, TEM, XPS, ellipsometry.
• Programming or scripting for data analysis/process optimization (preferred): Python, JMP, or MATLAB.
• Strong communication, collaboration, adaptability, attention to detail, and ownership of project deliverables.
• Must be eligible to work in the United States; this position is not eligible for Intel immigration sponsorship.

Education Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with ~4+ years of relevant semiconductor processing experience; OR a Master's degree in a relevant field with ~3+ years of relevant experience; OR a PhD in a relevant field (no prior professional experience required). Experience may be obtained through coursework, research, projects, or internships; related fields and equivalent practical experience are considered.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.