Module Development Engineer

Job Title

Module Development Engineer

Role Summary

The Module Development Engineer will develop and optimize manufacturing processes, defect inspection tools, and equipment solutions for high-volume semiconductor production. The role partners with equipment and material suppliers to implement scalable, cost-effective technologies aligned to Intel's roadmap.

This position focuses on process feasibility, equipment optimization, and pathfinding for next-generation device architectures.

Experience Level

Entry-level — College graduate / early career. Typical candidate has 1+ years of relevant engineering experience in semiconductor processing, automation, or related fields.

Responsibilities

Key responsibilities include process development, feasibility studies, and supplier collaboration to enable high-volume manufacturing.

• Design, develop, and optimize advanced manufacturing processes, including materials selection, parameter optimization, and system design.
• Lead feasibility studies and pathfinding activities for new device architectures and process technologies.
• Develop and implement defect inspection technologies for current and future process nodes.
• Partner with equipment and material suppliers to integrate enabling technologies and drive cost-sensitive roadmaps.
• Recommend and execute equipment modifications to improve performance and production efficiency.
• Perform theoretical simulations and practical experiments to evaluate process technology feasibility.
• Monitor industry trends and incorporate relevant advancements into technology planning.

Requirements

Minimum technical requirements and preferred skills.

• Must-have: 1+ years of relevant engineering experience in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Must-have: Proficiency with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Must-have: Programming experience in Python or MATLAB.
• Must-have: Hands-on experience with robotics, automation systems, vision systems, or image processing.
• Must-have: Authorization to work in the United States without company sponsorship (position is not eligible for Intel immigration sponsorship).
• Nice-to-have: Experience in advanced packaging, packaging processes, or equipment automation development.
• Nice-to-have: Demonstrated troubleshooting of manufacturing processes and equipment; project management experience.
• Nice-to-have: Strong problem-solving skills and ability to manage multiple tasks in a fast-paced environment.

Education Requirements

Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a STEM-related field is required (the posting specifies Bachelor's with 1+ years of relevant experience). Preferred qualifications include a Master’s degree or PhD in Mechanical Engineering, Electrical Engineering, or a related STEM field.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.