Module Design Engineering Intern
Support the design and testing of RF power amplifier and transmit modules (GaAs HBT) for wireless communications within High Performance Analog, Advanced Cellular, or Connectivity and Sensors groups. Tasks include simulation, layout, component integration, and hands-on RF measurements under the supervision of design engineers.
This internship provides practical engineering experience, mentorship, and exposure to project workflows; specific assignments depend on business needs.
Entry-level (Internship). Intended for students currently enrolled in BS, MS, or PhD programs; no minimum professional experience required.
Typical internship responsibilities include:
Must-have and preferred skills:
Pursuing a BS, MS, or PhD in Electrical Engineering or a similar technical field; required coursework in RF circuit design (including lab). Other relevant coursework may include analog circuit design, electromagnetics, and solid-state devices.
Company: Qorvo
Headquarters: Greensboro, NC, US
Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.
