Mixed-signal Design Architect, HBM Architecture
Micron TechnologyJob Title
Mixed-signal Design Architect, HBM Architecture
Role Summary
Design and specify analog and mixed-signal circuits, power delivery, thermal management, and on-/off-chip interfaces for 3D-stacked high-bandwidth memory (HBM) products. Work within the Next-generation HBM Architecture team to evaluate trade-offs, define technology and circuit requirements, and produce architecture documentation used by design and packaging teams.
Experience Level
Senior-level role. Preferred 5+ years of relevant experience delivering mixed-signal circuit designs, 3D-stacked memory or complex packaging architectures.
Responsibilities
Primary responsibilities include architecture definition, circuit implementation specification, simulation, and analysis for stacked-memory products.
- Design, optimize, and simulate critical analog and mixed-signal circuits.
- Architect and design power delivery for high-performance, stacked memories.
- Analyze, specify, and prototype on-chip and off-chip interfaces.
- Perform timing, area, power, and complexity analysis for high-performance, low-power circuits.
- Define architectures and approaches for improved thermal management.
- Conduct pathfinding and feasibility activities for future-generation stacked-memory products.
- Compose and maintain clear architecture and specification documentation.
Requirements
Key must-have technical skills and preferred additional skills.
- Must-have: Experience with analog and/or mixed-signal design including simulation and floorplanning.
- Must-have: Transistor-level simulation experience (e.g., FineSim, HSPICE) including corner analysis.
- Must-have: Experience with power delivery analysis, tradeoffs, constraints, and challenges for high-performance designs.
- Must-have: Ability to analyze architecture trade-offs and convert findings into specifications.
- Nice-to-have: Familiarity with DRAM or 3D-stacked memory devices (e.g., HBM) and stacked-memory packaging architectures.
- Nice-to-have: Contributions to thermal or power-delivery solutions for stacked architectures.
- Nice-to-have: Experience with scripting languages (Python, Perl) and hardware description languages (e.g., Verilog).
Education Requirements
Masters or PhD in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field preferred; equivalent practical experience also acceptable.
US base salary range: $146,000 - $297,000 per year.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
