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MEOS - Module Engineer On Shift

Intel Corporation
August 11, 2026
Full-time
On-site
Phoenix, Arizona, United States
$99,030 - $139,810 USD yearly
Process Engineering Jobs, Level - Mid-Career

Job Title

Module Engineer On Shift (MEOS)

Role Summary

The Module Engineer On Shift provides engineering support for microelectronic packaging assembly and test operations, focusing on package design/development, sustaining, and production support. This role partners with manufacturing, factory quality, and equipment teams to resolve production issues, execute DOEs and NPIs, and maintain process and recipe integrity.

Experience Level

Mid-level. Typical roles require multiple years of relevant semiconductor experience; see Education Requirements for degree/experience combinations.

Responsibilities

Day-to-day responsibilities center on supporting operations, ensuring product/process readiness, and resolving production issues.

  • Prioritize and execute engineering DOEs, pre-op meeting preparation, documentation and action tracking.
  • Support New Product Introductions: evaluate recipe needs, order collateral, create and validate recipes.
  • Act as first point of contact for Manufacturing and spend >75% of time on the production floor.
  • Contain, mitigate and solve issues using POR tools and methods (logs, SPC, tool error messages, checklists, feedback files, validation data).
  • Identify, document and drive resolution for quality excursions and Out-of-Control events in partnership with Factory Quality.
  • Disposition and release unscheduled hold lots within 10 hours and scheduled hold lots within 24 hours.
  • Support equipment troubleshooting with MTEs and provide clear pass-downs of issues and resolutions.
  • Consolidate and prioritize area improvement projects and support working groups and task forces with experiments and engineering data.
  • Train, certify and endorse manufacturing teams on new operations after early processing and validation.

Requirements

Must-have skills and experience for immediate contribution to a high-volume semiconductor packaging floor.

  • Relevant hands-on experience in semiconductor equipment development, semiconductor product development, high-volume technology manufacturing, or automated manufacturing.
  • Ability to work on-site in Phoenix, AZ and operate on assigned shift (Shift 6); must spend majority of time on the production floor.
  • Strong technical problem-solving and troubleshooting skills in a dynamic operations environment.
  • Proven collaboration skills with cross-functional teams and ability to prioritize multiple activities.
  • Comfortable using process-control and diagnostic tools, documenting results, and executing containment/mitigation steps.
  • Intel does not provide immigration sponsorship for this position.

Education Requirements

Minimum: Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience. Master’s degree in those fields with 6+ months of relevant experience is also listed as a minimum qualification in the source posting. "Related field" is accepted as stated in the posting.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-08-10