Memory Signal Integrity Engineer

Job Title

Memory Signal Integrity Engineer

Role Summary

Deliver high-speed signal integrity solutions for complex platforms, boards, and packages. Perform modeling and measurements, define signal integrity rules, and produce electrical specifications and implementation guidance to meet platform performance targets.

Join the Silicon and Platform Engineering Group (SPE) to collaborate with IP design and silicon integration teams on next-generation interfaces and platform-level requirements.

Experience Level

Entry-level. Position expects 0–1 years of hands-on experience or a Master's degree with no prior professional experience; suitable for recent graduates or candidates with internship/academic project experience.

Responsibilities

Key responsibilities include simulation, rules definition, test structure design, and cross-team collaboration to ensure signal integrity across platforms.

• Develop and deliver signal integrity solutions for high-speed interconnects in platforms, boards, and packages.
• Perform 2D and 3D electromagnetic and circuit-level modeling and simulations for die-to-die and platform interconnects.
• Define signal integrity rules and implementation guidelines; optimize design margins.
• Design, simulate, and characterize test structures; correlate simulation results with measurements using high-speed equipment.
• Collaborate with IP design and silicon integration teams to minimize signal degradation and control costs.
• Produce electrical specifications, characterization reports, and implementation documentation to support platform improvements.

Requirements

Must-have technical skills and other required qualifications. Education requirements are summarized separately below.

• Knowledge of signal integrity concepts and trade-offs: attenuation, crosstalk, jitter, and power noise.
• Experience with signal integrity simulation tools and high-speed measurement equipment.
• Proficiency in developing and analyzing 2D and 3D models for electrical structures and interconnects.
• Ability to debug interconnect challenges and drive design optimizations.
• Intermediate to advanced English proficiency (verbal and written).
• Unrestricted permanent right to work in Costa Rica.

Nice-to-have:

• Experience on high-speed platforms, board, or package designs.
• Familiarity with industry standards and consortium activities for next-generation interfaces.
• Strong cross-team communication and problem-solving skills.

Education Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field with 0–1 years of hands-on experience (including internships, academic projects, coursework, or hands-on training), OR a Master's degree in Electrical Engineering, Computer Engineering, or a related field with no prior professional experience. The posting allows demonstrated skills gained via internships or academic work as qualifying experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.