Memory Package Integration Architect

Job Title

Memory Package Integration Architect

Role Summary

Technical pathfinding role to define long-term packaging technology and system architecture for next-generation memory products across datacenter and edge-AI platforms. The role coordinates across silicon, packaging, materials, electrical, thermo-mechanical and system performance teams and engages with customers and senior leaders to translate architectural direction into scalable product roadmaps.

Experience Level

Mid-level - expects experienced individual. The posting specifies 6+ years of relevant industry experience.

Responsibilities

Primary responsibilities focus on package architecture, cross‑stack optimization, technical leadership, and applying AI-driven analysis methods.

• Define next-generation package pathfinding and system architectures optimized for speed, bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board, and system with a package-centric solutions approach.
• Drive long-term memory packaging strategy and influence industry standards.
• Partner with silicon and system design teams and external customers on disruptive solutions to boost performance for edge-AI and datacenter products.
• Serve as technical interface to internal partners, customers, business units, and senior leaders.
• Develop AI-based multi-physics solutions to improve engineering efficiency.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Must-have: 6+ years of hands-on experience in memory systems package design, signaling, IO design, and PDN design.
• Must-have: Deep understanding of memory timing, signaling, power delivery, and package process technology.
• Must-have: Working knowledge of EDA tools for design, analysis and simulation of electronic packaging (examples: Cadence, Siemens, Ansys).
• Must-have: Experience applying AI or large language models to engineering workflows or efficiency improvements.
• Nice-to-have: Recognized technical leadership across multiple products and demonstrated influence on architecture or standards.
• Nice-to-have: Experience in signal and power integrity analysis, mechanical and reliability analysis, and thermal analysis.
• Nice-to-have: Expertise in memory systems architecture.

Education Requirements

Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field, or equivalent practical experience is indicated as a minimum. A Master’s or PhD in a related technical field is listed as preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.