Job Title
Memory Design Engineer — HBM (TPG)
Role Summary
Contribute to design and delivery of next-generation HBM memory products across circuit design, layout, and validation. Apply simulation, modeling, and verification to improve design quality and manufacturability and support tape-out readiness and technology scaling.
Experience Level
Mid-level. Typically for engineers with several years of hands-on experience in memory or mixed-signal circuit design.
Responsibilities
Primary responsibilities include circuit design, layout management, verification, and cross-functional coordination to deliver manufacturable memory products.
- Support circuit design, layout, and optimization for memory, logic, or analog circuits.
- Perform parasitic extraction, modeling, and validation, including reticle experiments and tape-out revisions.
- Oversee layout activities: floor-planning, placement, and routing.
- Perform verification using modeling and simulation with industry-standard simulators.
- Collaborate with cross-functional teams to drive standardization and ensure manufacturability.
- Partner with Probe, Assembly, Test, Process Integration, Product Engineering, and Marketing to support tape-out readiness.
- Incorporate guidance from CAD, modeling, and verification teams to improve design quality.
Requirements
Must-have technical skills and experience:
- Extensive knowledge of CMOS circuit design and semiconductor device physics.
- Experience with schematic entry and hardware description languages (Verilog).
- Experience with circuit simulators such as FastSPICE and HSPICE.
- Strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.
- Experience with modeling, simulation, and verification using industry-standard tools.
- Experience supporting layout and tape-out validation flows.
Nice-to-have:
- Scripting experience (Python, TCL, Perl).
- Prior RTL design flow experience in DRAM or foundry processes.
- Experience with design-for-test (DFT) concepts or implementation.
- Strong verbal and written communication skills and collaborative work style.
Education Requirements
Bachelor's degree in Electrical Engineering or a related field is specified; Master's degree is preferred. The posting allows equivalent practical experience. It states 4+ years relevant experience with a Bachelor’s degree, or 2+ years with a Master’s degree.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-05-08