Memory/Advanced Packaging Strategy Technologist

Job Title

Memory/Advanced Packaging Strategy Technologist

Role Summary

Support Memory Technology Roadmap and strategy for the Varian Business Unit (Silicon Products Group). Work with marketing, technical, and engineering teams to define technology inflections, translate them into process-equipment and integration requirements, and produce market sizing, forecasting, and executive presentations for internal and external stakeholders.

The role focuses on Memory and Advanced Packaging integration, demo/integration support, IP generation, competitor and customer analysis, and prioritizing opportunities across the next 10 years of technology evolution.

Experience Level

Mid-level. Requires at least 5 years of semiconductor processing experience as a lead process integration engineer or device engineer.

Responsibilities

Provide technical and market strategy support across memory and advanced packaging domains.

• Monitor industry technology roadmaps and identify key inflection points over the next 10 years and their implications for Applied Materials.
• Collaborate with marketing, technical, and engineering teams to define future memory challenges and equipment requirements.
• Translate memory technology inflections to process-equipment and integration needs; support integrated demo and integration efforts.
• Write and file intellectual property to protect developed integration solutions.
• Develop technical and marketing collateral to promote solutions.
• Gather and analyze customer and competitor data; provide strategic updates and act as a thought partner to stakeholders.
• Perform nodal sizing, forecasting, and market-share analysis; prioritize penetration opportunities by customer and inflection segment.
• Construct executive-level presentations for internal and external audiences as needed.

Requirements

Key skills, experience, and attributes required or preferred for the role.

• Must-have: Excellent understanding of memory technologies (DRAM, NAND), process integration, and device physics.
• Must-have: Minimum of 5 years' experience in semiconductor processing as a lead process integration or device engineer.
• Must-have: Strong presentation, data-analysis, and communication skills; ability to work effectively across levels and functions.
• Must-have: Proven ability to analyze technology and economic environments, track customer investment plans, and identify emerging markets.
• Nice-to-have: Good understanding of advanced packaging processes and integration schemes.
• Nice-to-have: Knowledge of effective use of AI applications for engineering process optimization.
• Leadership: experience leading projects with notable complexity and defining execution strategy.
• Problem solving: ability to solve complex, novel problems with broad business impact.

Education Requirements

Advanced degree required: M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related technical field.

About the Company

Company: Applied Materials

Headquarters: Santa Clara, CA, United States

Global leader in materials engineering solutions for the semiconductor and display industries, designing, manufacturing, and servicing equipment used to produce chips and advanced displays worldwide. Enables customers' production of semiconductor devices and display technologies and supports innovations like AI and IoT.