Mechanical Simulation Engineer – Advanced Packaging

Job Title

Mechanical Simulation Engineer – Advanced Packaging

Role Summary

Drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging (HBM, 2.5D, 3D) to enable robust package designs through simulation, material characterization, and validation.

Integrate Generative AI and AI/ML tools to accelerate modeling workflows, improve predictive accuracy, and automate simulation tasks while collaborating with package architecture, fabrication, and assembly teams.

Experience Level

Mid-level — 2–5 years of relevant industry experience preferred.

Responsibilities

Primary tasks include developing and applying simulation methodologies to predict mechanical and reliability behavior of advanced packages.

• Perform linear and nonlinear static and multiphysics (thermal, structural, fluidic) finite-element analyses.
• Conduct fatigue, fracture mechanics, and reliability simulations; analyze failure mechanisms and life prediction.
• Model interface behavior including contact, shear, delamination, and interfacial damage.
• Develop and validate material models for polymers, composites, and thin-film stacks.
• Support HBM, 2.5D/3D packages, through-silicon vias (TSV), and hybrid bonding technologies.
• Develop automation workflows, scripting, and toolchains for simulation setup, solving, and post-processing.
• Apply AI/ML for surrogate and reduced-order models, design optimization, and simulation acceleration.
• Collaborate with global cross-functional teams to influence design and process integration decisions.

Requirements

Must-have technical skills and demonstrated capabilities; concise list of required and preferred items.

• Proven experience with finite-element or multiphysics simulation (linear and nonlinear) and reliability analysis.
• Experience in fatigue, fracture mechanics, and failure analysis methodologies.
• Experience developing and validating material models for polymers, composites, and thin films.
• Ability to build automation and scripting for simulation workflows and post-processing.
• Practical experience applying data-driven methods, AI/ML, or surrogate modeling to accelerate simulations.
• Familiarity with semiconductor packaging processes such as thermo-compression bonding, reflow, and wafer bonding.
• Strong problem-solving skills and ability to communicate technical results to cross-functional teams.
• Nice-to-have: experience with reduced-order modeling, advanced multiphysics coupling, or hybrid bonding/TSV technologies.

Education Requirements

Prefer degree in Mechanical Engineering, Materials Science/Engineering, or a related technical field — or equivalent practical experience in mechanical/materials engineering within semiconductor or advanced packaging domains.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.