Mechanical Engineering Internship – Summer 2027
QualcommJob Title
Mechanical Engineering Internship – Summer 2027
Role Summary
Qualcomm is hiring Mechanical Engineering interns to contribute to design, simulation, and testing of mechanical and thermal systems that support advanced semiconductor products. Interns work on project teams within the Mechanical Engineering track on tasks such as IC packaging, chip/package co-design, thermal modeling, and cooling solutions.
Experience Level
Entry-level internship. Candidates typically have academic coursework and project experience; the posting requests at least 1+ years of academic experience with programming languages such as Python or Matlab.
Responsibilities
Interns are expected to contribute as individual contributors on engineering teams. Typical responsibilities include:
- Design, simulate, and test mechanical and thermal components for semiconductor systems.
- Perform thermal modeling, CFD and heat-transfer analysis to inform cooling and heatsink designs.
- Support chip/package co-design, IC packaging structure analysis, and mechanical reliability assessments.
- Run experiments and validation: signal/power integrity tests, fan performance, airflow bench or wind tunnel measurements.
- Collaborate with cross-functional engineers and follow mentor-directed project plans.
Requirements
Key requirements and relevant skills for candidates.
- Must-have: Availability for an 11–14 week internship during Summer 2027 (May–September).
- Must-have: 1+ years of academic experience with programming (Python, Matlab).
- Preferred / Nice-to-have: Familiarity with Cadence SiP, AutoCAD, or SolidWorks.
- Preferred / Nice-to-have: Coursework or experience in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA).
- Preferred / Nice-to-have: Experience with thermal system design, modeling, and testing; heat transfer and microelectronics mechanical design.
- Preferred / Nice-to-have: Exposure to server product design, system impedance testing, fan performance measurement, heatsink design methodology, or CFD and airflow testing.
- Compliance: This internship may require an export license for candidates from certain countries; an export license may delay or prevent start dates.
- Other: Internship aligns to potential future roles that are not eligible for Qualcomm immigration sponsorship.
Education Requirements
Currently enrolled in a Bachelor's, Master's, or Ph.D. program in Mechanical Engineering, Materials Science, or a related technical field. Expected graduation of November 2027 or later (preferred graduation window: November 2027 through June 2028). Enrollment in a qualifying degree program is required for internship eligibility.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
