Mechanical Engineer

Job Title

Mechanical Engineer

Role Summary

Join AMD's Advanced Packaging team to develop mechanical solutions for semiconductor packages and cooling systems, driving designs from concept through production. The role involves close collaboration with packaging architects, suppliers, manufacturing, thermal, reliability, and supply-chain teams to deliver manufacturable solutions for AI, HPC, FPGA, ASIC, and SoC products.

Experience Level

Mid-level. This role expects demonstrated experience in mechanical design and semiconductor packaging; no specific years of experience are stated.

Responsibilities

Primary responsibilities include mechanical design, integration, and supplier engagement to bring advanced packaging solutions to production:

• Support development of advanced semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
• Drive mechanical design activities: CAD modeling, tolerance analysis, fit checks, and DFM reviews.
• Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements.
• Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure quality and manufacturability.
• Perform thermo-mechanical modeling and package integration using tools such as Creo and ANSYS Mechanical.
• Contribute to chip, package, board, and system-level integration efforts and product ramp activities.
• Support development of next-generation packaging, cooling, and materials technologies.

Requirements

Must-have skills and experience:

• Semiconductor packaging experience supporting ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products.
• Mechanical design experience including CAD modeling, GD&T, tolerance analysis, DFM, and design reviews.
• Familiarity with thermo-mechanical modeling using ANSYS Mechanical or similar tools.
• Understanding of chip-package interaction, package-board interaction, and package integration.
• Experience working with suppliers, contract manufacturers, or packaging development partners.
• Knowledge of advanced packaging technologies and manufacturing processes.
• Role is not eligible for visa sponsorship.

Nice-to-have:

• Experience with advanced cooling solutions, thermal technologies, or emerging packaging materials.

Education Requirements

MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field. Equivalent industry experience may be considered.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.