Mechanical Design Engineer β Semiconductor Packaging
The Mechanical Design Engineer is the primary contact for mechanical collateral design supporting semiconductor packaging architecture. The role designs mechanical components, tooling, and packaging fixtures used across assembly and test, and works closely with architecture, process, and assembly teams to ensure manufacturable designs.
Entry-level. The role expects approximately 1+ years of relevant CAD or mechanical design experience.
Accountable for mechanical design deliverables that enable semiconductor packaging and assembly processes.
Minimum qualifications and role expectations.
Bachelor's degree in Mechanical Engineering or a related STEM field is required; a Master's in Mechanical Engineering or related STEM field is preferred. The posting indicates experience may be obtained through a combination of degree, research, relevant jobs, or internships (equivalent practical experience acceptable).
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
