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Mechanical Design Engineer β€” Semiconductor Packaging

Intel Corporation
June 02, 2026
Full-time
On-site
Phoenix, Arizona, United States
$105,650 - $149,150 USD yearly
Other Semiconductor Jobs, Level - Entry or Early Career

Job Title

Mechanical Design Engineer β€” Semiconductor Packaging

Role Summary

The Mechanical Design Engineer is the primary contact for mechanical collateral design supporting semiconductor packaging architecture. The role designs mechanical components, tooling, and packaging fixtures used across assembly and test, and works closely with architecture, process, and assembly teams to ensure manufacturable designs.

Experience Level

Entry-level. The role expects approximately 1+ years of relevant CAD or mechanical design experience.

Responsibilities

Accountable for mechanical design deliverables that enable semiconductor packaging and assembly processes.

  • Design tape-and-reel packaging for die shipments from fab to assembly.
  • Develop and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
  • Design process media trays used during assembly and handling operations.
  • Collaborate with architecture, process, and assembly teams to validate design intent and manufacturability.
  • Serve as the single point of contact for packaging mechanical design collateral.
  • Identify and resolve design and process issues to meet project schedules.

Requirements

Minimum qualifications and role expectations.

  • Must-have: U.S. citizenship and ability to obtain and maintain a U.S. Government TS/SCI security clearance with polygraph.
  • Must-have: 1+ years' practical experience with 2D/3D CAD tools such as SolidWorks, Siemens NX, AutoCAD or similar.
  • Must-have: Ability to work on-site in Phoenix, AZ.
  • Nice-to-have: Experience with mechanical packaging components (substrates, IHS, stiffeners) and process fixtures.
  • Nice-to-have: Strong 3D spatial awareness, ability to interpret and generate technical drawings and specifications, and effective cross-functional communication skills.
  • Nice-to-have: Strong project and time management skills; experience troubleshooting design-for-manufacturing issues.

Education Requirements

Bachelor's degree in Mechanical Engineering or a related STEM field is required; a Master's in Mechanical Engineering or related STEM field is preferred. The posting indicates experience may be obtained through a combination of degree, research, relevant jobs, or internships (equivalent practical experience acceptable).


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-06-03