Mechanical Design Engineer - Semiconductor Packaging
Intel CorporationJob Title
Mechanical Design Engineer - Semiconductor Packaging
Role Summary
Design mechanical components, tooling, and packaging collateral to support semiconductor packaging and assembly. Serve as the primary contact for mechanical design deliverables, work cross-functionally with architecture, process, and assembly teams, and ensure designs are manufacturable and delivered on schedule.
Experience Level
Entry-level (1+ years of relevant experience)
Responsibilities
Primary responsibilities include mechanical design, detailed drawings, tooling development, and cross-functional coordination.
- Design Tape-and-Reel packaging for semiconductor die shipments.
- Create and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
- Design process media trays and other handling fixtures used during assembly.
- Develop tooling and fixtures required through the packaging and assembly lifecycle.
- Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.
- Act as the single point of contact for packaging mechanical design collateral needs.
- Identify and resolve design and process issues to meet project timelines.
Requirements
Must-have technical and security qualifications; preferred skills listed below.
- US Citizenship and ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
- 1+ years' experience with 2D/3D CAD tools such as SolidWorks, Siemens NX, AutoCAD, or similar.
- Experience creating and interpreting technical drawings and specifications.
- Strong communication, time management, and project-management skills for cross-functional collaboration.
- Ability to work on-site in Phoenix, AZ.
Preferred:
- Solid mechanical design foundation and 3D spatial awareness.
- Experience supporting semiconductor packaging or assembly processes.
Education Requirements
Bachelor's degree in Mechanical Engineering or a STEM-related field required. Master's degree in Mechanical Engineering or a STEM-related field is preferred. The posting notes relevant experience may be obtained through a combination of degree, research, previous job, or internship experiences.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
