Mechanical Design Engineer - Semiconductor Packaging
Design and develop mechanical components, tooling, and packaging collateral used across semiconductor packaging and assembly. Serve as the single point of contact for packaging mechanical design deliverables and collaborate with architecture, process, and assembly teams to ensure manufacturability and timely execution.
Entry-level β 1+ years of relevant experience (early-career engineer).
Primary responsibilities include design, documentation, and cross-functional coordination for semiconductor packaging mechanical components.
Must-have technical skills, security, and work-eligibility requirements; preferred items listed separately.
Nice-to-have:
Bachelor's degree in Mechanical Engineering or a STEM-related field required. Master's degree in Mechanical Engineering or a related STEM field is preferred. Equivalent practical experience (combination of degree, research, job or internship experience) is considered in evaluating qualifications.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
