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Mechanical Design Engineer - Semiconductor Packaging

Intel Corporation
June 02, 2026
Full-time
On-site
Phoenix, Arizona, United States
$105,650 - $149,150 USD yearly
Other Semiconductor Jobs, Level - Entry or Early Career

Job Title

Mechanical Design Engineer - Semiconductor Packaging

Role Summary

Design and develop mechanical components, tooling, and packaging collateral used across semiconductor packaging and assembly. Serve as the single point of contact for packaging mechanical design deliverables and collaborate with architecture, process, and assembly teams to ensure manufacturability and timely execution.

Experience Level

Entry-level β€” 1+ years of relevant experience (early-career engineer).

Responsibilities

Primary responsibilities include design, documentation, and cross-functional coordination for semiconductor packaging mechanical components.

  • Design tape-and-reel packaging for die shipments from fab to assembly.
  • Develop and maintain detailed mechanical designs and drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
  • Design process media trays for assembly-stage handling and transport.
  • Act as the single point of contact for packaging mechanical design collateral.
  • Work cross-functionally with architecture, process, and assembly teams to validate design intent and manufacturability.
  • Identify and resolve design and process issues to meet project schedules.

Requirements

Must-have technical skills, security, and work-eligibility requirements; preferred items listed separately.

  • US Citizenship required.
  • Ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
  • Minimum 1+ years' experience using CAD tools such as SolidWorks, Siemens NX, AutoCAD, or similar 2D/3D CAD software.
  • Strong communication and time/project management skills; able to work cross-functionally with minimal supervision.
  • Ability to interpret and produce technical drawings and specifications.

Nice-to-have:

  • Solid mechanical design foundation and 3D spatial awareness.
  • Experience with semiconductor packaging or assembly processes.

Education Requirements

Bachelor's degree in Mechanical Engineering or a STEM-related field required. Master's degree in Mechanical Engineering or a related STEM field is preferred. Equivalent practical experience (combination of degree, research, job or internship experience) is considered in evaluating qualifications.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-06-03