Mechanical Design Engineer — Semiconductor Packaging

Job Title

Mechanical Design Engineer — Semiconductor Packaging

Role Summary

Design and develop mechanical components, tooling, and packaging collateral for semiconductor packages across the packaging and assembly lifecycle. Serve as the single point of contact for packaging mechanical design and work with architecture, process, and assembly teams to ensure manufacturability and timely project delivery.

This role is part of Intel Foundry's packaging and assembly efforts supporting high-volume semiconductor manufacturing.

Experience Level

Entry-level / Early-career — 1+ years of relevant mechanical design experience; expected to work independently on defined design tasks with limited supervision.

Responsibilities

Primary responsibilities include mechanical design, documentation, and cross-functional support:

• Design tape-and-reel packaging for semiconductor die shipments from fab to assembly.
• Develop and maintain detailed mechanical designs and drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
• Design process media trays and related tooling used during assembly stages.
• Collaborate with architecture, process, and assembly teams to validate design intent and manufacturability.
• Act as the single point of contact for packaging mechanical design collateral and proactively identify and resolve design or process issues to meet schedules.

Requirements

Must-have qualifications and clearances; preferred items noted separately.

• US Citizenship required.
• Ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
• Minimum 1 year experience with 2D/3D CAD tools such as SolidWorks, Siemens NX, AutoCAD, or similar.
• Ability to interpret and generate technical drawings and specifications.
• Strong communication, time management, and project coordination skills for cross-functional work.

Nice-to-have:

• Solid mechanical design foundation and strong 3D spatial awareness.
• Experience with semiconductor packaging or assembly processes.

Education Requirements

Bachelor's degree in Mechanical Engineering or a STEM-related field is required; a Master’s in Mechanical Engineering or related STEM field is preferred. Equivalent combinations of degree, research, internship, or relevant job experience may be considered acceptable.

Location: On-site in Phoenix, AZ.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.