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Mechanical Design Engineer – Semiconductor Packaging

Intel Corporation
May 28, 2026
Full-time
On-site
Phoenix, Arizona, United States
$105,650 - $149,150 USD yearly
Other Semiconductor Jobs, Level - Entry or Early Career

Job Title

Mechanical Design Engineer – Semiconductor Packaging

Role Summary

Design mechanical components, tooling, and packaging assemblies for semiconductor products and act as the primary contact for packaging mechanical design collateral. Work cross-functionally with architecture, process, and assembly teams to ensure manufacturability and timely execution. This role requires an on-site presence in Phoenix, AZ.

Experience Level

Entry-level / Early Career — requires 1+ years of relevant mechanical design or CAD experience.

Responsibilities

Primary responsibilities include mechanical design for semiconductor packaging, tooling, and process fixtures.

  • Design tape-and-reel packaging for semiconductor die shipments from fab to assembly.
  • Develop and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
  • Design process media trays used during stages of the assembly process.
  • Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.
  • Serve as the single point of contact for packaging mechanical design collateral needs.
  • Identify and resolve design and process issues to meet project schedules.

Requirements

Must-have and preferred skills for initial consideration.

  • Must-have: US citizenship and ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
  • Must-have: 1+ years' experience with 2D/3D CAD tools (e.g., SolidWorks, Siemens NX, AutoCAD) and experience generating technical drawings.
  • Must-have: Practical mechanical design skills for small-part assemblies and tooling; ability to troubleshoot design/process issues.
  • Nice-to-have: Strong 3D spatial awareness and solid mechanical design foundation.
  • Nice-to-have: Excellent communication and interpersonal skills for cross-functional collaboration.

Education Requirements

Bachelor's degree in mechanical engineering or a STEM field required. Master's degree in mechanical engineering or a STEM field preferred.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-05-28