Mechanical Design Engineer – Semiconductor Packaging
Design mechanical components, tooling, and packaging assemblies for semiconductor products and act as the primary contact for packaging mechanical design collateral. Work cross-functionally with architecture, process, and assembly teams to ensure manufacturability and timely execution. This role requires an on-site presence in Phoenix, AZ.
Entry-level / Early Career — requires 1+ years of relevant mechanical design or CAD experience.
Primary responsibilities include mechanical design for semiconductor packaging, tooling, and process fixtures.
Must-have and preferred skills for initial consideration.
Bachelor's degree in mechanical engineering or a STEM field required. Master's degree in mechanical engineering or a STEM field preferred.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
