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Mechanical Design Engineer - Semiconductor Packaging

Intel Corporation
June 01, 2026
Full-time
On-site
Phoenix, Arizona, United States
$105,650 - $149,150 USD yearly
Other Semiconductor Jobs, Level - Entry or Early Career

Job Title

Mechanical Design Engineer - Semiconductor Packaging

Role Summary

Serve as the single point of contact for mechanical design collateral supporting semiconductor packaging architecture. Design and develop mechanical components, tooling, and detailed drawings used throughout packaging and assembly to ensure manufacturability and meet program requirements.

Experience Level

Entry-level / Early career. The role expects at least 1 year of relevant experience with CAD and mechanical design tools.

Responsibilities

Primary responsibilities include designing packaging components, producing drawings, and coordinating across teams to deliver manufacturable designs.

  • Design Tape-and-Reel packaging for die shipments from fab to assembly.
  • Develop and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
  • Design process media trays used during assembly and handling operations.
  • Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.
  • Act as the single point of contact for packaging mechanical design collateral needs.
  • Identify and resolve design and process issues to meet project schedules.
  • Manage time and project deliverables with minimal supervision.

Requirements

Must-have qualifications and skills for initial consideration; preferred items noted separately.

  • US Citizenship required.
  • Ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
  • Minimum 1+ year experience with 2D/3D CAD tools such as SolidWorks, Siemens NX, AutoCAD, or similar.
  • Strong communication and interpersonal skills for cross-functional collaboration.
  • Ability to interpret and generate technical drawings and specifications; strong attention to detail.
  • Self-directed problem solving and basic project/time management skills.
  • Preferred: solid mechanical design foundation and 3D spatial awareness; prior semiconductor packaging or assembly experience is a plus.

Education Requirements

Bachelor's degree in Mechanical Engineering or a STEM-related field is required. A Master's degree in Mechanical Engineering or a STEM-related field is preferred.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-05-30