Mechanical Design Engineer - Semiconductor Packaging

Job Title

Mechanical Design Engineer - Semiconductor Packaging

Role Summary

As a Mechanical Design Engineer supporting semiconductor packaging, you will design mechanical components, tooling, and packaging collateral across the assembly lifecycle. You will act as the single point of contact for packaging mechanical design and work cross-functionally with architecture, process, and assembly teams to ensure manufacturability and design intent.

Your primary focus is creating detailed mechanical designs and drawings, resolving design/process issues, and managing project activities to meet schedule and quality targets.

Experience Level

Entry-level; requires approximately 1+ years of relevant experience.

Responsibilities

Primary responsibilities include mechanical design, documentation, and cross-functional coordination for semiconductor package components and tooling.

• Design tape-and-reel packaging for die shipments from fab to assembly.
• Develop and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and full package assemblies.
• Design process media trays and assembly tooling used during packaging operations.
• Collaborate with architecture, process, and assembly teams to confirm design intent and manufacturability.
• Serve as the single point of contact for packaging mechanical design collateral needs.
• Identify and resolve design and process issues and manage multiple projects under tight deadlines.

Requirements

Minimum qualifications and preferred skills. Note: This position is not eligible for Intel immigration sponsorship.

• Must-have: 1+ year experience with 2D and 3D CAD software; strong mechanical design fundamentals and 3D spatial awareness; ability to interpret and generate technical drawings and specifications.
• Nice-to-have: Experience with SolidWorks, Siemens NX, AutoCAD; experience in semiconductor packaging or related high-precision manufacturing; familiarity with material properties and mechanical tolerances used in package design and tooling.

Education Requirements

Required: Bachelor's degree in mechanical engineering or a STEM-related field. Preferred: Master's degree in mechanical engineering or a STEM-related field. Relevant knowledge may also come from a combination of coursework, research, internships, or relevant work experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.