Mechanical Design Engineer - Power Modules and Power Packages

Job Title

Mechanical Design Engineer - Power Modules and Power Packages

Role Summary

Design and integrate mechanical structures for power modules and discrete power packages within the Power Modules and Power Packages R&D team. Focus areas include assembly-process compatibility, thermal management, reliability, manufacturability, and support for SiC/GaN-based solutions for traction and industrial applications.

Experience Level

Mid-level. The role expects approximately 3+ years of mechanical design experience in power electronics or semiconductor packaging.

Responsibilities

Primary responsibilities include mechanical design, integration with manufacturing, and supporting prototyping and validation.

• Design housings, substrates, interconnects, cooling systems, and other mechanical structures for power modules and packages.
• Ensure designs are compatible with assembly processes (sintering, gel-filling/potting, press-fit/soldering, wire/clip bonding, encapsulation/molding, large-area soldering/sintering).
• Develop 3D CAD models and detailed drawings using SolidWorks, Inventor, CATIA, or similar tools.
• Collaborate with process engineers to align designs with automated and semi-automated assembly lines.
• Support prototyping, lab testing, validation, and supplier/manufacturing coordination to ensure feasibility and quality.
• Contribute to design-for-manufacturing (DFM) and design-for-reliability (DFR) initiatives and maintain design documentation, version control, and release processes.
• Perform or specify mechanical simulations (stress, vibration, thermal expansion); FEA experience is a plus.

Requirements

Must-have technical skills and workplace expectations.

• 3+ years' experience in mechanical design, preferably in power electronics or semiconductor packaging.
• Proficiency in CAD tools (SolidWorks, Inventor, CATIA) and practical use of FEA tools preferred.
• Solid understanding of materials used in power electronics (metals, ceramics, polymers) and their mechanical/thermal properties.
• Experience with assembly processes relevant to power modules and packages and familiarity with thermal management techniques (heat sinks, TIMs, liquid cooling).
• Knowledge of reliability standards and environmental testing (e.g., JEDEC, IEC).
• Strong problem-solving skills and ability to work in cross-functional teams; fluent in English. Knowledge of Chinese is a plus.
• Willingness to travel up to approximately 25% of working time.

Education Requirements

Bachelor's or Master's degree in Mechanical Engineering or a related field.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.