Manufacturing Operations Technical Programme Manager – Silicon and Packaging

Job Title

Manufacturing Operations Technical Programme Manager – Silicon and Packaging

Role Summary

Manage silicon production, packaging design, packaging manufacturing and delivery through contract manufacturers. Act as the primary technical interface between Fractile, the foundry, OSAT partner and internal operations to ensure milestones, schedules, risks and handoffs from wafer production to packaged silicon delivery are met.

Experience Level

Mid-level. Requires 5+ years of technical project/programme management, operations or supply-chain experience in semiconductors or complex hardware.

Responsibilities

Lead and coordinate end-to-end manufacturing programmes for silicon and packaging; contribute to building scalable programme management practices across the organisation.

• Own the project plan from wafer production through packaged silicon delivery and shipment.
• Coordinate day-to-day activity with foundry, OSAT, packaging, logistics and contract manufacturing partners.
• Track milestones across wafer starts, fab progress, packaging, assembly, final test, qualification and shipment.
• Manage risks, dependencies and schedule changes; resolve issues with engineering teams and external partners.
• Ensure manufacturing documentation, test requirements, quality requirements and build-readiness materials are complete.
• Support NPI, prototype builds, qualification and production ramp.
• Lead manufacturing operations programme reviews and contribute to portfolio-level reviews that surface risk early.
• Design and roll out scalable planning, forecasting, reporting, risk and change-control practices for programmes.

Requirements

Core skills and experience required for effective performance in the role.

• 5+ years in technical project management, operations, supply chain or programme management in semiconductors or complex hardware.
• Experience working with foundries, OSATs, packaging suppliers or contract manufacturers.
• Strong understanding of semiconductor production and packaging flows.
• Proven ability to manage complex schedules, multiple stakeholders, technical dependencies and supplier risks.
• Experience with tools such as Jira, Confluence, Linear, Asana, Smartsheet, MS Project or PLM systems.
• Experience operating in a rapidly scaling organisation and building processes during growth.
• Highly organised, strong prioritisation and risk-management instincts; clear communicator with engineers and executives.

Nice-to-have:

• Advanced packaging, high-performance compute, chiplets, 2.5D/3D integration or HBM-based packages.
• Familiarity with silicon bring-up, NPI, qualification, yield tracking and production ramp.
• Experience working with Asian semiconductor supply chains and partners.

Education Requirements

Not specified.

About the Company

Company: Fractile

Headquarters: London, UK

Fractile is on a mission to revolutionize AI by developing silicon, systems, and software that enable the fastest execution of advanced models at lower costs. Established in 2022, the company has rapidly expanded, fostering a collaborative culture in its London and Bristol offices. With a focus on innovation in ML/AI IC product development, Fractile combines hardware and software to deliver high-impact solutions for data center applications.