Job Title
Low Yield Analysis (LYA) Group Leader / Operations Manager
Role Summary
Lead the Low Yield Analysis group and oversee start-up and operation of a new laboratory focused on back-end advanced package fault isolation and failure analysis in Chandler/Phoenix, AZ. Manage a team of engineers and technicians to deliver inline defect characterization, fault isolation, failure analysis, and yield improvement for leading-edge logic packaging.
Drive tooling, data-analysis, equipment qualification, and yield-improvement roadmaps while coordinating with peer engineering groups and factory stakeholders.
Experience Level
Senior — role expects experienced operations and technical leadership. Preferred: 8+ years in advanced manufacturing or operations management. Minimum experience guidance present in Education Requirements.
Responsibilities
Primary responsibilities include technical leadership, lab start-up, and operational delivery.
- Oversee start-up and operation of a fault-isolation and failure-analysis laboratory for advanced packaging.
- Manage and develop a team of yield development engineers and technicians; set goals and maintain accountability.
- Evaluate and improve methods and tools to reduce defects and improve yield; guide development with metrology and core competency groups.
- Define inline monitoring schemes, custom process flows, and test layouts to detect end-of-line (EOL) failures inline.
- Develop and deploy tools, algorithms, and methodologies for in-line and offline yield/defect data analysis and statistical interpretation.
- Specify, procure, qualify, and harden capital equipment to meet technology development and high-volume manufacturing needs.
- Coordinate with factory and program stakeholders; present findings to peers and senior management.
- Drive long-term strategies for process integration and yield-engineering capabilities to support future requirements.
- Maintain onsite presence to support operational needs for employees whose roles require onsite work.
Requirements
Must-have skills, clearances, and experience to be considered initially.
- US Citizenship required.
- Ability to obtain and maintain a US Government TS/CSI security clearance with polygraph.
- Minimum 2+ years' experience in semiconductor or advanced manufacturing.
- Minimum 1+ year experience in capital equipment management and/or sourcing.
- Minimum 1+ year experience as a personnel manager, lead, or mentor.
- Willingness and ability to be regularly onsite to support operations and managed staff.
Nice-to-have (preferred):
- 8+ years advanced manufacturing or operations management experience.
- Active TS/CSI security clearance with polygraph.
- Experience managing both technicians and exempt employees.
- Knowledge of advanced packaging architectures (2.5D / 3D disaggregation), device physics, and common silicon failure modes.
- Experience with test program development, parametric test evaluation, and electrical fault isolation.
- Familiarity with fab wafer back-end processing and advanced packaging assembly techniques.
- Experience with failure-analysis sample preparation and tools (mechanical cross-sectioning, planar grinding, de-lidding, FIB, SEM/TEM).
- Strong written and oral communication, problem solving, and analytical troubleshooting skills.
Education Requirements
Minimum: Master’s degree plus 4+ years of relevant experience, or PhD plus 2+ years of relevant experience in Chemistry, Physics, Electrical Engineering, Mechanical Engineering, Materials Science, or other relevant applied engineering field. Qualifications may also be met through a combination of industry experience, internships, coursework, or research where noted in the posting.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-06-22