Low Yield Analysis Engineer on Shift

Job Title

Low Yield Analysis Engineer on Shift

Role Summary

APTD LYA supports back-end package assembly and wafer-level test to identify and root cause yield loss and in-line electrical failures. The engineer on shift performs hands-on lab testing, characterization, and failure analysis of wafer-level and package assemblies while coordinating across technicians, yield, integration, and external suppliers.

Lab-based, on-site role working on a rotating shift schedule to deliver root-cause determinations, recommended corrective actions, and documentation to stakeholders.

Experience Level

Mid-level. Candidates typically have demonstrated hands-on failure analysis and electrical fault isolation experience; hiring guidance indicates at least 1+ years of relevant lab experience.

Responsibilities

Execute technical and operational activities to identify and resolve manufacturing yield and electrical failures.

• Perform hands-on lab testing, data acquisition, and electrical characterization of wafer and package assemblies.
• Conduct failure analysis and defect/process characterization to determine root causes.
• Develop and apply failure-analysis techniques, best known methods, and documentation.
• Interface with internal teams and external suppliers to drive yield improvements and meet program milestones.
• Support project management, package design/development, and sustaining activities.
• Respond to customer requests and events during assigned shift.
• Communicate findings verbally and through written reports to yield engineers and other stakeholders.

Requirements

Must-have technical experience and working traits for immediate consideration.

• 1+ years prior lab experience involving defect characterization or electrical fault isolation techniques.
• Hands-on experience with electrical fault isolation tools and methods (e.g., hand probe, curve tracer, auto probing, TDR, EBAC, ELITE or similar).
• Experience with destructive/optical analysis or compositional techniques is a plus (SEM, x-ray, microscopy, CSAM, TEM, FIB, EDX, AFM, FTIR, Raman, XRD).
• Familiarity with package/die mapping tools and basic scripting/analysis (SQL, JMP) is desirable.
• Strong analytical, problem-solving, communication, and presentation skills; able to work across teams and handle ambiguity.
• On-site, lab-based availability and willingness to work assigned shift schedule.
• Position is not eligible for Intel immigration sponsorship.

Education Requirements

Master's degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field; equivalent practical experience or relevant coursework/internships/training will also be considered.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.