Lead Engineer, Packaging Project

Job Title

Lead Engineer, Packaging Project

Role Summary

Lead packaging engineering projects for Allegro's semiconductor products at the Paranaque site. Responsible for package design decisions, assembly process engineering, qualification planning, and delivering projects on scope, schedule, budget, and quality standards.

Experience Level

Senior — typically 3 to 5 years of experience in semiconductor packaging and assembly engineering.

Responsibilities

Key responsibilities include:

• Manage and execute assigned packaging projects to meet scope, schedule, budget, and quality targets.
• Serve as the packaging and assembly expert; make design and process engineering decisions and resolve technical issues.
• Create and refine bonding diagrams and contribute to the development and maintenance of package design rules.
• Lead bill-of-material selection to optimize performance, cost, and manufacturability.
• Develop, execute, and oversee qualification plans and review assembly and qualification data; drive corrective actions and improvements.
• Track critical tasks and milestones; identify potential delays and implement corrective actions.
• Identify, document, and escalate project risks and resource conflicts; propose mitigations to the Technical Project Manager.
• Collaborate with design, product lines, manufacturing, and quality teams to ensure seamless project execution.
• Ensure deliverables comply with Advanced Quality Planning (AQP) and internal documentation procedures; maintain thorough records.
• Lead or participate in structured problem-solving (e.g., Ishikawa, 8D) and apply quality tools to resolve deviations; may mentor junior engineers.

Requirements

Must-have qualifications and skills:

• 3–5 years of hands-on experience in semiconductor packaging and assembly engineering with proven technical project execution.
• Demonstrated ability to make package design and assembly process engineering decisions.
• Strong practical experience with quality and reliability tools such as DFMEA, PFMEA, Ishikawa, DRBFM, and Design for Manufacturability/Quality/Cost.
• Solid project-management discipline with technical leadership and risk-management skills.
• Highly organized, detail-oriented, and strong problem-solving capability.
• Excellent written and spoken English; strong interpersonal and communication skills.
• Proficiency in Microsoft Excel and PowerPoint.

Nice-to-have:

• Experience mentoring junior engineers and coordinating cross-functional teams on BOM selection and qualification activities.

Education Requirements

Bachelor's degree (BS) in an engineering field such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

About the Company

Company: Allegro MicroSystems

Headquarters: Manchester, New Hampshire, USA

Global semiconductor company with over 30 years of innovation, developing semiconductor devices and design enablement tools. Allegro focuses on device development, foundry partnerships, IP characterization, and design automation to support product roadmaps and technology advancement.