Lead Engineer, Package Development

Job Title

Lead Engineer, Package Development

Role Summary

Lead the development and transfer of semiconductor packages from design to volume production. Define test strategies, lead validation and qualification, and drive yield and process improvements for complex products.

Work cross-functionally with device design, manufacturing, quality, reliability and business teams to ensure on-time releases and product profitability.

Experience Level

Senior — requires demonstrated experience; role context indicates ~5+ years in semiconductor product design, development, or manufacturing.

Responsibilities

Primary responsibilities include hands-on technical leadership, documentation, and cross-functional coordination:

• Define test strategies and lead validation and qualification efforts for new products.
• Drive yield improvement and manufacturability enhancements during product introduction.
• Collaborate with Business Units, Device Design, internal and subcontract manufacturing, Quality and Reliability teams.
• Create, maintain, and release technical documentation: SOPs, process flows, workflows, bonding diagrams, package outline drawings.
• Support adoption of process documentation and report on internal procedures and regulatory/qualification requirements.

Requirements

Must-have technical skills and experience (degree and years listed in Education Requirements below):

• Strong expertise with AutoCAD and familiarity with GD&T standards.
• Proficient with 3D CAD tools such as Autodesk Inventor, SolidWorks, or PTC Creo.
• Proficient with Microsoft Word, Excel, PowerPoint, Project, Visio or equivalents.
• Strong oral and written communication skills; self-driven and results-oriented.
• Familiarity with project management practices and APQP processes.
• Familiarity with industry qualification standards such as JEDEC, AEC-Q100, ASME, IPC, IEC.

Nice-to-have:

• Experience with package design rules and packaging materials (epoxies, molding compounds, wires, solders, leadframe alloys).
• Knowledge of assembly processes: wafer back-grind, dicing, wafer bumping, die attach, flip chip, wire bonding, transfer/injection molding, MCM, surface mount, plating, singulation.

Education Requirements

Bachelor's (BS) or Master's (MS) in Electrical Engineering, Mechanical Engineering, Materials Science, or a closely related technical field. The posting specifies 5+ years of experience in semiconductor product design, development, or operations/manufacturing.

About the Company

Company: Allegro MicroSystems

Headquarters: Manchester, New Hampshire, USA

Global semiconductor company with over 30 years of innovation, developing semiconductor devices and design enablement tools. Allegro focuses on device development, foundry partnerships, IP characterization, and design automation to support product roadmaps and technology advancement.