Lead Application Engineer
Define and lead development of advanced packaging and 3DIC analysis flows for foundry and customer solutions focused on signal integrity (SI), power integrity (PI), electromagnetic and thermal analysis.
Work with customers and internal teams (R&D, product engineering, marketing) to evaluate environments, propose solutions, and ensure customer success.
Senior β minimum 15 years of relevant industry experience (SI/PI/EM/Thermal/RF for package and PCB design).
Primary responsibilities include technical leadership, solution development, and customer engagement.
Core technical and interpersonal requirements. Items labeled "preferred" are not strict requirements.
Bachelor's degree in Electrical or Electronics Engineering is required; Master's degree is preferred. (No mention of acceptable equivalent experience was provided.)
Company: Cadence Design Systems
Headquarters: San Jose, California, USA
Cadence Design Systems is a global electronic design automation company that provides software, hardware, and intellectual property for designing advanced semiconductor chips. With over 25 years in the industry, Cadence is known for its innovative technology solutions and has been recognized by Fortune Magazine as one of the 100 Best Companies to Work For. The company is dedicated to solving complex technical challenges in order to enable customers to create revolutionary products and experiences.
