Layout Engineer (2027 Campus Hiring)

Job Title

Layout Engineer (2027 Campus Hiring)

Role Summary

Design and prepare multi-dimensional semiconductor layouts for mixed-signal analog ICs, with emphasis on automotive Class-D audio power amplifiers. Work includes floorplanning, routing, physical verification (DRC/LVS/QRC), parasitic mitigation, and packaging/lead-frame integration.

The role is part of a global layout team (Shanghai and U.S.) and collaborates closely with analog designers, packaging, process, EDA, and production teams to deliver layouts that meet performance, reliability, and die-size targets.

Experience Level

Early-career / campus-hire level. Suitable for new graduates or engineers at the start of their career.

Responsibilities

Primary responsibilities include:

• Translate schematics and design geometry into detailed multi-layer layouts and artwork.
• Create floorplans and perform routing for mixed-signal and high-current power blocks.
• Run physical verification (DRC, LVS, QRC) and resolve rule violations.
• Address parasitic impacts and perform iterative post-layout optimization with circuit designers.
• Participate in layout reviews and confirm verifications and specifications are met.
• Collaborate with packaging teams to develop custom lead-frames and ensure package integration.
• Coordinate with global team members across sites to meet area, performance, and schedule constraints.

Requirements

Technical and interpersonal requirements. Degree and GPA are listed under Education Requirements below.

• Must-have: Experience or training in analog/mixed-signal IC layout, floorplanning, routing, and physical verification flows (DRC/LVS/QRC).
• Must-have: Familiarity with parasitic extraction impacts, high-current power routing, and layout techniques for analog matching and reliability.
• Must-have: Experience with EDA/layout tools and established layout flows; ability to learn site-specific toolchains quickly.
• Must-have: Ability to work in cross-functional, geographically distributed teams and to communicate layout trade-offs to designers and packaging engineers.
• Nice-to-have: Prior exposure to automotive ESD/EMC rules, lead-frame/package co-design, or high-power Class-D audio ICs.
• Nice-to-have: Demonstrated problem-solving, time-management, and ability to drive results under project schedule constraints.

Education Requirements

Bachelor's degree in engineering is required, typically in Electrical Engineering or a closely related field. The posting specifies a cumulative GPA of 3.0/4.0 or higher.

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.