Intern - Process Engineering (Defect)
MicrochipJob Title
Intern - Process Engineering (Defect)
Role Summary
This is an internship supporting process engineering with a focus on defect analysis at Microchip's Colorado Springs fabrication site. The intern will work with the process/defect engineering team to collect data, perform basic analyses, and support experiments that help identify and reduce manufacturing defects.
Experience Level
Entry-level / Internship. Suitable for current students or recent graduates seeking hands-on semiconductor process experience.
Responsibilities
Typical responsibilities for this position include:
- Assist engineers with defect characterization and failure analysis activities.
- Collect, record, and clean process and defect-related data.
- Operate or support use of basic lab and inspection equipment under supervision (e.g., optical inspection, SEM, metrology tools).
- Execute defined experiments and test recipes, and document results accurately.
- Support continuous improvement efforts by contributing observations and suggested corrective actions.
- Maintain clear documentation and follow safety and process control procedures.
Requirements
Minimum and preferred qualifications (concise):
- Basic laboratory and data-collection skills; attention to detail.
- Familiarity with Excel or similar tools for data entry and simple analysis.
- Good written and verbal communication; able to document results and follow instructions.
- Able to work onsite at the Colorado Springs facility for the duration of the internship.
- Nice-to-have: exposure to semiconductor processes, microscopy, or statistical analysis.
Education Requirements
Not specified.
About the Company
Company: Microchip
Headquarters: Chandler, Arizona, USA
Microchip is a leading semiconductor company focused on developing innovative solutions to enhance the human experience. With a commitment to empowering innovation, Microchip prioritizes the value of its employees by fostering a culture that supports their growth and contributions.
