Intern, Package Development Engineering — Advanced Packaging (High Bandwidth Memory & New Product Introduction)

Job Title

Intern, Package Development Engineering — Advanced Packaging (High Bandwidth Memory & New Product Introduction)

Role Summary

This is a full-time internship on the package development engineering team focused on advanced semiconductor packaging and High Bandwidth Memory (HBM) new-product introduction. The intern will evaluate packaging technologies, analyse engineering datasets, apply design-of-experiment methods, and support technology qualification and transfer activities.

Experience Level

Entry-level internship for students currently enrolled in a technical degree program. Minimum commitment: 3–6 months full time.

Responsibilities

Primary tasks and expected contributions:

• Study advanced semiconductor packaging concepts and development workflows related to HBM.
• Analyse engineering datasets to evaluate packaging performance and technology readiness.
• Design and interpret experiments using design-of-experiment methodologies.
• Explore data analysis and AI-enabled tools to support engineering studies.
• Participate in project reviews and learn technology qualification and transfer processes.
• Document findings in engineering reports, visualisations/dashboards, and a final presentation.

Requirements

Must-have skills and attributes for successful performance in the internship:

• Strong analytical thinking and problem-solving ability.
• Basic understanding of data analysis concepts and experience working with technical data.
• Ability to organise, visualise, and interpret datasets; produce clear reports and presentations.
• Good verbal and written communication and ability to collaborate in cross-functional teams.
• Interest in semiconductor packaging, experimental methods, and digital analysis tools.

Education Requirements

Currently pursuing a university degree (undergraduate level) in Chemical Engineering, Materials Science, Electrical & Electronics Engineering, Mechanical Engineering, Computer Engineering, Data Science, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.