Intern - Memory Design Engineer, HBM

Job Title

Intern - Memory Design Engineer, HBM

Role Summary

Internship on the High Bandwidth Memory (HBM) Design team focused on design, development, and validation of HBM products. Work involves RTL, circuit-level analysis, simulation, verification, and collaboration with Verification, Physical Design, CAD, and Product Engineering teams.

Hands-on exposure to semiconductor design flows, EDA tools, automation and AI-assisted workflows while contributing to active product projects.

Experience Level

Entry-level (Internship). Intended for students currently pursuing a Bachelor's or Master’s degree in a technical discipline.

Responsibilities

Key responsibilities include:

• Support HBM memory and logic design tasks: RTL development, circuit implementation, simulation, verification, and functional analysis.
• Develop and apply scripting, automation, and AI-assisted workflows to improve productivity and debug efficiency.
• Perform timing, power, and functional analysis of HBM subsystems and participate in design reviews and technical investigations.
• Collaborate with Design Verification, Physical Design, CAD, and Product Engineering to support project execution.
• Document technical work, experimental results, methodologies, and AI-assisted findings to support team knowledge sharing.

Requirements

Must-have technical skills and attributes:

• Understanding of combinational and sequential logic design concepts; familiarity with Verilog, SystemVerilog, or VHDL.
• Programming/scripting experience in Python, Perl, Tcl, C/C++ or similar languages.
• Strong analytical, debugging, problem-solving, communication, and teamwork skills.

Nice-to-have:

• Knowledge of memory architectures (DRAM, SRAM, DDR, LPDDR, HBM).
• Experience with RTL design, simulation, synthesis, timing analysis, or verification from coursework, research, or prior internships.
• Familiarity with Linux/Unix, EDA tools (e.g., VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso), and functional coverage or verification methodologies.
• Prior academic, research, or internship experience in VLSI, ASIC, FPGA, memory design, or applying AI tools to engineering workflows.

Education Requirements

Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field. Relevant coursework expected: Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or equivalent subjects/experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.