Intern, Industrial Engineering
RenesasJob Title
Intern, Industrial Engineering
Role Summary
Support the Manufacturing team at Renesas Bayan Lepas to improve semiconductor back-end operations. The intern will analyze process flows, assist with factory layout design, perform time studies, and gain hands‑on exposure to test and packaging equipment.
This is an on-site internship at the Bayan Lepas facility, with a preferred placement duration of 4–6 months beginning around Aug 26.
Experience Level
Entry-level (Internship). Suitable for current students or recent graduates; preferred availability 4–6 months starting Aug 26.
Responsibilities
Key responsibilities include:
- Analyze and optimize wafer sort, final test, and backend process flows.
- Assist in factory floor layout design using AutoCAD for equipment placement and space utilization.
- Conduct time studies for final test and backend operations and analyze data in Excel to identify efficiency improvements.
- Support hands-on work with semiconductor test, handling, and packaging equipment under supervision.
- Document findings and propose process improvements to Manufacturing engineers.
Requirements
Minimum non-degree requirements and preferences:
- Proficiency with Microsoft Excel for data analysis (preferred).
- Familiarity with AutoCAD is an advantage.
- Available for a 4–6 month on-site placement; state internship period in application.
Education Requirements
Degree in Manufacturing, Process, Mechanical, or Electronics Engineering is specified (internship-level academic standing expected, e.g., undergraduate student or recent graduate).
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.
