Intern - Engineer, HIG HBM DTPCO

Job Title

Intern - Engineer, HIG HBM DTPCO

Role Summary

The intern will perform bench-level characterization, modeling, and root-cause analysis of High Bandwidth Memory (HBM) cubes to support Design Technology Co-Optimization (DTPCO) objectives. Work includes designing test fixtures, executing thermal/mechanical/electrical experiments, analyzing silicon data, and developing test software and models.

Experience Level

Internship / Entry-level role. The posting specifies 3+ years of relevant semiconductor characterization or test engineering experience.

Responsibilities

Execute experiments, develop test code, and analyze multi-domain data to identify failure modes and improve product performance.

• Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using lab equipment (power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, probe cards).
• Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions; evaluate power-temperature correlation, warpage, timing margin, and failure onset.
• Develop and maintain test programs, stress patterns, workloads, and observability features using Python and additional languages (C/C++ or Verilog).
• Analyze MBIST signatures and electrical/thermal/mechanical datasets to identify root causes across design, process, package, assembly, or test interactions and recommend corrective actions.
• Apply AI and generative/agentic tools to accelerate data analysis, test development, and engineering workflows.

Requirements

Must-have technical skills and experience; preferred items listed below.

• 3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a closely related field.
• Hands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware.
• Programming experience in Python plus at least one additional language such as C/C++ or Verilog; ability to develop automated test flows.
• Experience analyzing complex datasets and conducting root-cause investigations using statistical and engineering methods.

Nice-to-have:

• Experience with DRAM, HBM, memory subsystems, advanced packaging, or silicon characterization.
• Knowledge of thermal/mechanical stress, reliability, yield improvement, DOE methodologies, and power-performance correlation techniques.
• Experience with MBIST analysis, parametric characterization, and semiconductor test methodologies.
• Familiarity with AI-enabled tools or AI-assisted coding platforms to improve productivity and automation.

Education Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field is required. A Master's or PhD in those fields is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.