Intern - Design Engineer, HIG HBM
Micron TechnologyJob Title
Intern - Design Engineer, HIG HBM
Role Summary
Work with the High Bandwidth Memory (HBM) design team on semiconductor design, simulation, verification, and analysis for next-generation memory products. Collaborate with cross-functional engineering teams and apply automation and AI-assisted workflows to improve design productivity and debug efficiency.
Experience Level
Entry-level internship intended for students or early-career engineers; hands-on learning role with mentorship from experienced memory engineers.
Responsibilities
Key day-to-day responsibilities include:
- Assist with design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard EDA tools.
- Support RTL development, circuit implementation, timing and power analysis, and functional validation.
- Develop scripts and automation solutions, including AI-assisted workflows, to improve design productivity and debug efficiency.
- Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews and debug activities.
- Document technical work, experimental results, AI-enabled insights, and design methodologies for knowledge sharing.
Requirements
Applicants should meet the technical must-haves below; preferred skills are listed after.
Must-have
- Understanding of combinational and sequential logic design concepts.
- Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work.
- Programming experience in Python, Perl, Tcl, C/C++, or similar languages.
- Strong analytical and problem-solving skills.
Nice-to-have
- Knowledge of memory architectures (DRAM, SRAM, DDR, LPDDR, HBM).
- Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage.
- Familiarity with Linux/Unix environments, scripting, and automation techniques.
- Exposure to EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms.
- Previous academic, research, or internship experience in VLSI, ASIC, FPGA, or semiconductor design; experience applying AI to engineering workflows.
Education Requirements
Currently pursuing a Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field. Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
