Intern Design Engineer - HIG HBM

Job Title

Intern Design Engineer - HIG HBM

Role Summary

Work on the High Bandwidth Memory (HBM) design team to support design, simulation, verification, and analysis of memory and logic circuits used in AI, HPC, graphics, and data-center applications. The role involves hands-on engineering with EDA tools, scripting/automation, and collaboration across design, verification, CAD, physical design, and product engineering teams.

Experience Level

Internship - targeted at students (undergraduate or graduate) currently pursuing a Bachelor's or Master's degree; entry-level, project- and course-oriented experience expected.

Responsibilities

Contribute to HBM circuit and RTL development, verification, and automation under mentor supervision.

• Assist with design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard tools.
• Support RTL development, circuit implementation, timing and power analysis, and functional validation.
• Develop scripts and automation (Python, Tcl, etc.) and apply AI-assisted workflows to improve productivity and debug efficiency.
• Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering on reviews and debugging.
• Document technical work, experimental results, and design methodologies for knowledge sharing.

Requirements

Must-have technical skills and practical experience gained via coursework, projects, or research.

• Demonstrated understanding of combinational and sequential logic design concepts.
• Experience with Verilog, SystemVerilog, or VHDL (academic or project experience acceptable).
• Programming/scripting experience (Python, Perl, Tcl, C/C++ or similar) and strong analytical/problem-solving skills.
• Ability to work in Linux/Unix environments and familiarity with scripting and automation techniques.

Nice-to-have:

• Knowledge of memory architectures (DRAM, SRAM, DDR, LPDDR, HBM).
• Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage.
• Exposure to semiconductor EDA tools (VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar).
• Previous academic, research, or internship experience related to VLSI, ASIC, or FPGA design; experience applying AI to engineering workflows.

Education Requirements

Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field. Relevant coursework includes Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, and Semiconductor Devices. Academic, research, or project experience in semiconductor design or equivalent practical experience is acceptable.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.