Intern - Design Engineer, HBM

Job Title

Intern - Design Engineer, HBM

Role Summary

Work on the High Bandwidth Memory (HBM) design team to assist with digital and circuit design, verification, simulation, and semiconductor development flows for next-generation memory products.

This internship provides hands-on experience collaborating with Design, Verification, Physical Design, Product Engineering, and CAD teams.

Experience Level

Entry-level - Internship. Intended for students currently enrolled in undergraduate or graduate programs.

Responsibilities

Key responsibilities include hands-on support for design, verification, and documentation.

• Assist with design, simulation, analysis, and verification of HBM memory and logic circuits using EDA tools.
• Support RTL development, circuit implementation, timing and power analysis, and functional verification.
• Develop scripting, automation, and AI-assisted workflows to improve design productivity and debug efficiency.
• Participate in design reviews, technical discussions, and debugging; apply AI-enabled analysis to accelerate root-cause identification.
• Document technical work, experimental results, methodologies, and AI-assisted insights to support team collaboration.

Requirements

Must-have technical skills and attributes for the internship. Nice-to-have items are listed below.

• Working knowledge of combinational and sequential logic design concepts.
• Familiarity with Verilog, SystemVerilog, or VHDL.
• Basic programming experience in Python, Perl, Tcl, C/C++ or similar languages.
• Demonstrated analytical, debugging, problem-solving, communication, and teamwork skills.

Nice-to-have:

• Knowledge of memory architectures (DRAM, SRAM, DDR, LPDDR, HBM).
• Experience with RTL design, simulation, synthesis, timing analysis, or verification methodologies.
• Familiarity with Linux/Unix and semiconductor design tools (e.g., VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso).
• Understanding of functional coverage and semiconductor development flows from spec through silicon validation.
• Prior academic, research, or internship experience in VLSI, ASIC, FPGA, memory design, or semiconductor engineering; exposure to AI-assisted engineering workflows.

Education Requirements

Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field. Relevant coursework examples: Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices. Equivalent practical experience not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.