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Intern - AI Hardware and Memory Systems

Micron Technology
September 16, 2026
Internship
On-site
Folsom, California, United States
$50.24 - $50.24 USD hourly
SoC Architecture Jobs, Level - Entry or Early Career

Job Title

Intern - AI Hardware and Memory Systems

Role Summary

Join the HBM Architecture team to research and prototype memory and system architecture concepts for next-generation AI accelerators and high-performance computing platforms. Work focuses on performance modeling, workload analysis, and evaluating memory hierarchy and interconnect design impacts on system performance and power efficiency.

This internship provides hands-on research experience collaborating with architects and engineers to influence future AI infrastructure.

Experience Level

Intern (PhD level). Entry-level: 0–2 years of relevant research or internship experience.

Responsibilities

Key responsibilities include architecture research, modeling, workload analysis, and cross-functional collaboration.

  • Research and evaluate memory and system architecture concepts for AI accelerators (GPUs, TPUs, custom designs).
  • Develop and analyze performance models for bandwidth, latency, power, scalability, and overall system efficiency.
  • Analyze AI training, inference, and HPC workloads to identify memory and system performance bottlenecks.
  • Investigate optimizations across memory hierarchy (HBM, DRAM, caches), storage, and interconnects.
  • Collaborate with cross-functional engineering teams and explore AI/LLM-based tools to support research workflows.

Requirements

Must-have technical skills and experience for this PhD internship.

  • 0–2 years of relevant experience through research, internships, academic projects, or industry work.
  • Knowledge of memory system architecture: caches, HBM, DRAM, memory hierarchy, and interconnect concepts.
  • Experience with performance modeling, architectural simulation, or system analysis.
  • Programming experience in Python, C++, or similar languages.
  • Strong analytical, problem-solving, and technical communication skills.

Nice-to-have:

  • Research experience with AI accelerators, GPU architecture, interconnects, or high-performance computing.
  • Experience with AI/ML frameworks (PyTorch, TensorFlow) or CUDA-based development.
  • Familiarity with architectural simulators, SystemC, GPU profiling tools, emulation platforms, or performance analysis tools.
  • Knowledge of rack-scale systems, scale-up/scale-out architectures, and advanced interconnect technologies.
  • Publications or demonstrated research contributions in computer architecture, AI hardware, or memory systems.

Education Requirements

Currently pursuing a PhD in Computer Architecture, Electrical Engineering, Computer Engineering, Computer Science, or a related technical field. PhD candidacy is explicitly required for this internship.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-09-15